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Preparation method for copper bus bar with high strength and high electrical conductivity

A high-conductivity, copper busbar technology, applied in the field of conductive copper busbars, can solve problems such as being unsuitable for industrial production, and achieve the effects of solving mass production, solving process obstacles, and ensuring deposition efficiency

Active Publication Date: 2015-07-29
STATE GRID CORP OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, this technology can only produce nano-scale pure copper thin films or a small amount of bulk nano-twinned materials, which is not suitable for industrial production.

Method used

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  • Preparation method for copper bus bar with high strength and high electrical conductivity
  • Preparation method for copper bus bar with high strength and high electrical conductivity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A strip-shaped nano-twinned copper strip blank with a rectangular cross section was prepared by pulse electrodeposition technology. Electrolyte is CuSO 4 The solution, wherein the copper ion concentration is about 100g / L, the added rare earth element Ce content is 0.3mg / L, and the pH value of the solution is controlled at 1-2. Cathode as figure 1 The grid-shaped stainless steel plate shown has a porosity of 50%, and the anode is a pure copper plate with a purity of 99.99%. The pulse current density is 80A / cm 2 , during the electrodeposition process, the electrolyte flow is forced by means of external circulation, and the electrodeposition temperature is kept constant. Then, the prepared nano-twinned copper strip blank is extruded and extended to prepare copper busbar products of required specifications. The extrusion expansion forming means that the nano-twinned copper strip blank enters the wheel groove of the extrusion wheel through the feed port, fills the inside...

Embodiment 2

[0019] The difference from Example 1 is that carbon nanotubes are added to the electrolyte to stabilize the nano-twinned copper material, and the concentration is about 0.5 mg / L. The pulse current density is 60A / cm 2 . The porosity of the cathode grid-shaped stainless steel plate is 30%. The nano-twinned copper strip blank is extruded and expanded to produce a copper busbar product with a size of 40mm*4mm. The tensile strength is about 920MPa, and the room temperature conductivity is close to 98% IACS.

Embodiment 3

[0021] The difference from Example 1 is that carbon nanotubes are added to the electrolyte to stabilize the nano-twinned copper material, and the concentration is about 0.4 mg / L. The pulse current density is 120A / cm 2 . The porosity of the cathode grid-shaped stainless steel plate is 60%. The nano-twinned copper strip blank is extruded and expanded to produce a copper busbar product with a size of 30mm*4mm. The tensile strength is about 923MPa, and the room temperature conductivity is close to 97% IACS.

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Abstract

The invention provides a preparation method for a copper bus bar with high strength and high electrical conductivity. The preparation method comprises the following steps of firstly, preparing by using a pulse electrodeposition method to obtain a nano twin-crystal copper strip billet; secondly, performing extruding, extending and forming on the nano twin-crystal copper strip billet to obtain the copper bus bar with high strength and high electrical conductivity. The preparation method is characterized in that an anode in the electrodeposition method is a copper plate, and a cathode in the electrodeposition method is a grid-hole-shaped stainless steel plate with the porosity of 30 to 60 percent. According to the preparation method provided by the invention, the grid-hole-shaped stainless steel plate is taken as the cathode in the pulse electrodeposition process; in addition, carbon nano-tubes and rare earth element Ce are added in electrolyte, so that the stability of an organization structure of a nano twin-crystal copper material is improved, and dynamic recovery of a twin-crystal organization due to temperature rise in the forming, welding and heavy current impact processes of the copper bus bar is avoided. The copper bus bar prepared by the preparation method disclosed by the invention has high strength and high electrical conductivity. The method disclosed by the invention has the advantages of high simplicity, low cost, good effect and high practicality.

Description

technical field [0001] The invention relates to a conductive copper busbar, in particular to a preparation method of a high-strength and high-conductivity copper busbar. Background technique [0002] Copper is widely used in electrical and electronic industries due to its excellent electrical conductivity. However, pure copper has low hardness, tensile strength, and creep resistance, and poor thermal stability, which makes it difficult to meet the strength requirements of the electrical and electronic industry under certain conditions. Traditional copper strengthening methods, such as fine grain strengthening, solid solution strengthening, etc., increase the grain boundary, dislocation, and second phase defects while improving the strength of copper, which increases the scattering of electrons and seriously reduces the conductivity of the material. . It can be said that there is a contradiction between the strength and conductivity of copper materials. Lu Ke et al. (Lu L,...

Claims

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Application Information

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IPC IPC(8): C25D5/18C25D3/38C25D7/00
CPCC25D3/38C25D5/18C25D7/00
Inventor 王利民何卫姚辉廖晶陈思敏
Owner STATE GRID CORP OF CHINA