Motor controller

Abstract

The invention relates to the technical field of controllers, and in particular relates to a motor controller. The motor controller comprises a support (1), a PCB (2) arranged on the support (1) and a cooling fin (3) arranged on the support (1), wherein a plurality of MOS tubes, which are divided into an upper bridge MOS tube set (4) and a lower bride MOS tube set (5), are arranged on the PCB (2), the upper bridge MOS tube set (4) is electrically connected with the input anode of the PCB (2) by a first copper strip (6), and the lower bride MOS tube set (5) is electrically connected with the input cathode of the PCB (2) by a second copper strip (7); the motor controller is good in electrical connection capacity, small in heating, convenient to machine and high in installing efficiency.

Description

technical field [0001] The invention relates to the technical field of controllers, in particular to a motor controller. Background technique [0002] The motor controller controls the motor to work according to the set direction, speed, angle and response time through the active work of the integrated circuit. The motor controller mainly includes a bracket, a PCB circuit board, and a heat sink, and a plurality of MOS tubes are arranged on the PCB circuit board. The motor controller of the prior art has the following disadvantages: [0003] 1. The positive and negative electrical networks on the PCB circuit board of the prior art are conducted through the copper foil on the PCB circuit board, so the current passing capacity is insufficient, the heat generation is large and the processing is troublesome; [0004] 2. In the prior art, each MOS tube needs to be fixed with a screw, and because the screw is arranged on the conductive part of the MOS tube, it needs to be insulate...

AI Technical Summary

Problems solved by technology

[0003] 1. The positive and negative electrical networks on the PCB circuit board of the prior art are conducted through the copper foil on the PCB circuit board, so the current passing capacity is insufficient, the heat generation is large and the processing is troublesome;

[0004] 2. In the prior art, each MOS tube needs to be fixed with a screw, and because the screw is arranged on the conductive part of the MOS tube, it needs to be insulated, so the process is cumbersome and the installation efficiency is low;

[0005] 3. The heat sink in the prior art covers the top of the MOS tube pins, so after the current is output from the MOS tube pins, it needs to be connected to the external phase line through the copper foil of the PCB circuit board, so the current passing capacity is insufficient, and the heat is relatively large And the processing is more troublesome

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