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A backing plate for PCB drilling and manufacturing method thereof

A manufacturing method and backing plate technology, which is applied in the direction of coating, epoxy resin coating, etc., can solve the problems of low backing plate hardness and poor flatness, and achieve the effects of improving surface hardness, increasing dosage, and improving coating process

Active Publication Date: 2018-04-20
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a backing plate for PCB drilling and its manufacturing method, aiming at solving the problems of low hardness and poor flatness of the existing backing plate

Method used

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  • A backing plate for PCB drilling and manufacturing method thereof
  • A backing plate for PCB drilling and manufacturing method thereof
  • A backing plate for PCB drilling and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045]Preparation of composite resin: by weight ratio, add 50% novolac epoxy acrylic resin, 42% calcium carbonate and calcium bicarbonate, 7.5% ethyl acetate and butyl acetate slowly into the mixing tank in sequence, heat to 50°C, and stir After mixing for 40 minutes, add Irgacure 1700 0.5%, then continue to stir for 10 minutes, then cool and discharge to obtain a composite resin;

[0046] Coating process: take high-density wood fiberboard as the substrate, firstly carry out dust removal treatment on the high-density wood fiberboard, then apply the above-mentioned composite resin on the surface of the high-density wood fiberboard, and roll it with a rubber roller first, Then use an anilox roller to flatten, and then UV drying and curing; after the curing is completed, the composite resin prepared above is also coated on the lower surface of the high-density wood fiber board, and then the mat is formed by using the same coating process as the upper surface of the backing board. ...

Embodiment 2

[0049] Preparation of composite resin: by weight, 65% of novolac epoxy acrylic resin, 30% of calcium bicarbonate, aluminum oxide, 3.8% of tetrapropylene glycol diacrylate and 3.8% of trihydroxypropane triacrylate are slowly added to the stirring tank in turn , heated to 40°C, stirred and mixed for 60 minutes, then added Irgacure 1700 1.2%, then continued to stir for 15 minutes, then cooled and discharged to obtain a composite resin;

[0050] Coating process: take high-density wood fiberboard as the substrate, firstly carry out dust removal treatment on the high-density wood fiberboard, then apply the above-mentioned composite resin on the surface of the high-density wood fiberboard, and roll it with a rubber roller first, Then use an anilox roller to flatten, and then UV drying and curing; after the curing is completed, the composite resin prepared above is coated on the lower surface of the high-density wood fiber board, and then the backing board is formed by using the same c...

Embodiment 3

[0053] In terms of weight ratio, slowly add 43% of novolak epoxy acrylic resin, 48% of aluminum oxide and talcum powder, 8% of ethyl acetate, butyl acetate, methyl isobutyl ketone, and butyl ester into the stirring tank in turn, and heat to 60 ℃, stir and mix for 30 minutes, add Irgacure 1700 1.0%, then continue to stir for 12 minutes, then cool and discharge to obtain a composite resin;

[0054] Coating process: take high-density wood fiberboard as the substrate, firstly carry out dust removal treatment on the high-density wood fiberboard, then apply the above-mentioned composite resin on the surface of the high-density wood fiberboard, and roll it with a rubber roller first, Then use an anilox roller to flatten, and then UV drying and curing; after the curing is completed, the composite resin prepared above is coated on the lower surface of the high-density wood fiber board, and then the backing board is formed by using the same coating process as the top surface of the backi...

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Abstract

The invention discloses a backing plate for PCB drilling and a manufacturing method thereof, which comprises the steps of adding 50-70% of novolak epoxy acrylic resin, 20-50% of filler and 0-10% of diluent in sequence according to the weight ratio Stir tank, heat to 40-60°C, stir and mix for 30-60 minutes, add 0.5-5% photoinitiator, then continue to stir for 10-15 minutes, then cool and discharge to prepare composite resin; use wood fiber board as substrate, in The upper and lower surfaces of the substrate are respectively coated with the composite resin prepared above, and cured under predetermined conditions to form a backing plate. The surface hardness of the backing plate for PCB drilling of the present invention is obviously improved, and the edge produced during drilling is effectively reduced, and the production efficiency of PCB drilling processing is improved.

Description

technical field [0001] The invention relates to the field of PCB mechanical drilling, in particular to a backing plate for PCB drilling and a manufacturing method thereof. Background technique [0002] The backing plate is often used in the drilling process of PCB, and the quality requirements of the backing plate for PCB drilling are very high, such as hardness, flatness and thickness tolerance are quite strict. Backing plates in the prior art are mostly formed by hot pressing of phenolic resin, and the phenolic resin is characterized by low hardness, large warping of the backing plate, and poor flatness. When the hardness of the phenolic resin is low, burrs are likely to occur during the PCB drilling process; and when the flatness of the backing plate is poor, it cannot be tightly combined with the PCB board, resulting in crooked holes and broken pins on the PCB board during drilling. [0003] Therefore, the prior art still needs to be improved and developed. Contents o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C09D163/10C09D7/61C08L97/02
Inventor 罗小阳贺琼张伦强刘飞
Owner SHENZHEN NEWCCESS IND