Neutral water base cleaning agent combination for circuit board

Abstract

The invention provides a neutral water base cleaning agent combination for a circuit board. The neutral water base cleaning agent combination comprises the following components in percentage by weight: 0.02 to 2% of C8-18 linear chain alkyl sulfhydryl, 0.02 to 2% of a specific sulfhydryl compound, 1 to 15% of an alcohol ether solvent, 0.02 to 5% of a nonionic surface active agent, water-soluble organic amine pH regulator and the balance of deionized water, wherein the specific sulfhydryl compound is a thiol-connected, benzene ring-free and nitrogenous five-membered heterocycle compound, and the adding amount of the water-soluble organic amine pH regulator is according to the ratio of 1:1 of an amine value to a thiol value in components. The neutral water base cleaning agent combination has a good capacity of removing flux residues after the circuit board is welded, can form composite hydrophobic organic membranes on most metal surfaces, and metals at PCB weld points and in electronic components are effectively protected and are prevented from being subjected to moisture absorption, corrosion and color change.

Description

technical field [0001] The invention belongs to the technical field of cleaning agents for the electronics industry, and in particular relates to a neutral water-based cleaning agent composition for circuit boards. Background technique [0002] Printed circuit board (hereinafter referred to as PCB) is an indispensable core component of electronic products. With the development trend of electronic product integration, high density, and high reliability, the design of the PCB used will be more compact, thin, short, multi-functional, and intelligent, and the quality requirements of the PCB are also getting higher and higher. During the PCB assembly and welding process, flux or a paste mixture of flux and tin powder (trade name: solder paste) is usually used as a soldering auxiliary material. The flux plays the role of removing the oxide film on the metal surface and reducing the surface tension of the molten solder to ensure the effectiveness of the soldering and the reliabili...

AI Technical Summary

Problems solved by technology

During the use of neutral water-based cleaning agents, the surfactant will be adsorbed on the metal surface. Even if the clean water is used for rinsing in the later stage, there is no guarantee that the surfactant residue on the PCB can be completely removed.

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