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Liquid silkscreen conducting resin and preparation method thereof

A technology of conductive adhesive and liquid silk, which is applied in the field of conductive adhesive, can solve the problems of conductive adhesive or conductive adhesive film, such as conductive performance, poor bonding effect, cumbersome use process, and low lamination pass rate, so as to achieve strong production practicability , low production cost, enhanced electrical conductivity

Inactive Publication Date: 2015-09-09
SHENZHEN JIARUIJUN NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a liquid screen printing conductive adhesive, which aims to solve the poor conductivity and bonding effect of the existing conductive adhesive or conductive adhesive film used in the preparation of reinforced flexible circuit boards, and is used to prepare reinforced flexible circuit boards The problems of cumbersome process, high cost and low lamination pass rate

Method used

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  • Liquid silkscreen conducting resin and preparation method thereof
  • Liquid silkscreen conducting resin and preparation method thereof
  • Liquid silkscreen conducting resin and preparation method thereof

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preparation example Construction

[0027] Correspondingly, the embodiment of the present invention also provides a preparation method of liquid screen printing conductive adhesive, comprising the following steps:

[0028] S01. According to the formula of the above-mentioned liquid screen printing conductive adhesive, weigh each component;

[0029] S02. adding the conductive silver particles to the epoxy-modified acrylic resin, and dispersing them in the reactor to obtain the first dispersion;

[0030] S03. Add the conductive crystal transistor and the conductive fiber to the above-mentioned first dispersion for dispersion treatment to obtain the second dispersion;

[0031] S04. Add the defoamer and the leveling agent to the above second dispersion for dispersion treatment to obtain a liquid conductive adhesive for screen printing.

[0032] Specifically, in the above-mentioned step S01 of the embodiment of the present invention, the formula and preferred components of the liquid screen printing conductive adhes...

Embodiment 1

[0040] A liquid screen printing conductive adhesive, based on the total weight of the liquid screen printing conductive adhesive as 100%, including the following components in the following weight percentages:

[0041]

[0042] The preparation method of described liquid screen printing conductive glue, comprises the following steps:

[0043] S11. According to the formula of the above-mentioned liquid screen printing conductive adhesive, weigh each component;

[0044] S12. Add the conductive silver particles to the epoxy-modified acrylic resin, and carry out dispersion treatment in the reactor to obtain the first dispersion. Disperse the damaged grinding disc for 90 minutes;

[0045] S13. Add the conductive crystal transistor and the conductive fiber to the above-mentioned first dispersion for dispersion treatment to obtain the second dispersion. The method of the dispersion treatment is to disperse for 60 minutes under the condition that the rotation speed is 500 rpm;

[...

Embodiment 2

[0048] A liquid screen printing conductive adhesive, based on the total weight of the liquid screen printing conductive adhesive as 100%, including the following components in the following weight percentages:

[0049]

[0050] The preparation method of described liquid screen printing conductive glue, comprises the following steps:

[0051] S21. According to the formula of the above-mentioned liquid screen printing conductive adhesive, weigh each component;

[0052] S22. Add the conductive silver particles to the epoxy-modified acrylic resin, and carry out dispersion treatment in the reactor to obtain the first dispersion. Disperse the damaged grinding disc for 85 minutes;

[0053] S23. Add the conductive crystal transistor and the conductive fiber to the above-mentioned first dispersion for dispersion treatment to obtain the second dispersion. The dispersion treatment method is to disperse for 65 minutes under the condition that the rotation speed is 450 rpm;

[0054] S...

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Abstract

The invention relates to the field of conducting resin and provides liquid silkscreen conducting resin and a preparation method thereof. The liquid silkscreen conducting resin comprises, by weight, 35-38% of epoxy modified acrylate resin, 28-31% of conductive silver particles, 14-16% of conductive crystal tubes, 16-18% of conductive fibers, 1.8-2.5% of an antifoaming agent and 1-1.2% of a levelling agent. The liquid silkscreen conducting resin has good electroconductibility, good bonding capability, stable performances and a low cost. Through use of the liquid silkscreen conducting resin in a reinforcing flexible substrate, processes are simplified and production efficiency is improved.

Description

technical field [0001] The invention belongs to the field of conductive adhesives, in particular to a liquid screen printing conductive adhesive and a preparation method thereof. Background technique [0002] In the preparation process of electronic products such as capacitive screens and liquid crystal screens, the capacitive screens and liquid crystal screens are connected to the main board through flexible circuit boards, and electronic components such as ICs are mounted on the flexible circuit boards. In order to prevent false soldering and false soldering during mounting, reinforcement is required behind the flexible circuit boards where electronic components such as ICs are to be mounted. At the same time, in order to protect electronic components such as ICs from electrostatic interference, the reinforcing materials are Conductive material, usually conductive steel plate. [0003] In order to connect the steel sheet with the flexible circuit board, the solid conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J151/08C09J9/02
Inventor 杜思斌
Owner SHENZHEN JIARUIJUN NEW MATERIAL TECH CO LTD
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