A method for measuring the three-dimensional microscopic topography of ultra-precision turning surfaces based on the characteristics of visible light reflection spectrum

A technology of reflection spectrum and measurement method, which is applied in the field of surface microscopic topography measurement, can solve the problems of slow measurement speed, unreliability of the surface to be measured, and limitation of measurement area, and achieve small impact on measurement accuracy, non-destructive quantitative measurement, and measurement high precision effect

Active Publication Date: 2017-12-22
HARBIN INST OF TECH
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Problems solved by technology

At present, these measurement methods have certain limitations. For example, the contact measurement method has a slow measurement speed and may damage the measurement surface. The surface roughness profiler can only measure the two-dimensional shape of the workpiece surface, and the atomic force scanning microscope can measure The three-dimensional shape of the workpiece, but the measurement area is limited, generally less than 100μm
The non-contact measurement method has a relatively small measurement range, such as white light interferometer, the measurement area is only 200μm, which has certain unreliability for the entire surface to be measured; Can not guarantee

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  • A method for measuring the three-dimensional microscopic topography of ultra-precision turning surfaces based on the characteristics of visible light reflection spectrum
  • A method for measuring the three-dimensional microscopic topography of ultra-precision turning surfaces based on the characteristics of visible light reflection spectrum

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[0033] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings, but it is not limited thereto. Any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention should be covered by the present invention. within the scope of protection.

[0034] Such as figure 1 As shown, a measuring device for three-dimensional microscopic topography of an ultra-precision turning surface based on the reflectance spectrum characteristics of visible light is composed of a visible light source 1, a collimating lens 2, a linear attenuation film 3, a small hole diaphragm 4, a workpiece to be measured 5, The rotary table 6, the lens 7, the optical fiber measuring head 8 and the spectrometer 9 are composed. The incident light output by the visible light source 1 is modulated by the collimating lens 2 and then ...

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Abstract

A method for measuring the three-dimensional microscopic topography of ultra-precision turning surfaces based on the reflection spectrum characteristics of visible light. The steps are as follows: the collimating lens modulates the incident light output by the visible light source to make it collimated; the collimated light is linearly attenuated After passing through the small hole diaphragm, the central light spot irradiates the surface of the tested workpiece which is clamped on the rotary table; the light spot diffracts on the surface of the tested workpiece, and the dispersed monochromatic waves will be separated according to different wavelengths and The stages are arranged in sequence to form a spectrum; after the spectrum passes through the lens, the reflected spectrum is modulated into collimated light, and the ±1-order spectrum of each wavelength is measured at different scanning positions through the optical fiber probe installed on the linear displacement stage. The measurement results are input into the spectrometer; the measurement results are calculated and analyzed by using the plane reflection grating equation, and the three-dimensional microscopic topography information of the surface of the measured workpiece is obtained. The invention realizes non-contact and non-destructive quantitative measurement, and the optical path is easy to adjust, and the measurement precision is high.

Description

technical field [0001] The invention belongs to the technical field of non-contact optical precision measurement, and relates to a method for measuring the surface microscopic topography by measuring the visible light reflection spectrum characteristics of a processed surface. Background technique [0002] In recent years, with the rapid development of high-tech fields such as aerospace, laser inertial confinement fusion, and micro-optical systems, higher and higher requirements have been placed on the surface quality of parts, which is related to the performance and reliability of parts. Therefore, the measurement of surface microscopic topography is of great significance for evaluating surface quality. [0003] Ultra-precision turning technology uses natural diamond tools to process parts on ultra-precision machine tools. Ultra-precision turning technology can process many kinds of materials, including various non-ferrous metals, such as single crystal germanium, aluminum...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/24
Inventor 王波吴东旭张鹏乔政赖志锋
Owner HARBIN INST OF TECH
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