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A kind of low-temperature vulcanized heat-conducting silicone rubber and preparation method thereof

A heat-conducting silicone rubber and low-temperature vulcanization technology, applied in the field of silicone rubber, can solve the problem of low thermal conductivity and achieve good processing performance

Active Publication Date: 2017-10-20
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent CN101284925B discloses the preparation method of silicone rubber / EPDM combined with thermally conductive silicone rubber, directly adding silane coupling agent to the mixed rubber, and the thermal conductivity of the prepared thermally conductive silicone rubber is 0.15~0.8W / (m·K ), the thermal conductivity is low

Method used

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  • A kind of low-temperature vulcanized heat-conducting silicone rubber and preparation method thereof
  • A kind of low-temperature vulcanized heat-conducting silicone rubber and preparation method thereof
  • A kind of low-temperature vulcanized heat-conducting silicone rubber and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] (1) Preparation of modified thermally conductive filler: Add 150 parts by mass of aluminum nitride with a particle size of 5 μm and 5 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r / min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

[0034] (2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000 cps at 25 ° C, 155 parts of modified thermally conductive fillers obtained in step (1), 30 parts White carbon black (fumed silicon dioxide), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa for deh...

Embodiment 2

[0037] (1) Preparation of modified thermally conductive filler: Add 120 parts by mass of alumina with a particle size of 5 μm and 3 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r / min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

[0038] (2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000cps at 25°C, 123 parts of modified thermally conductive fillers obtained in step (1), and 30 parts White carbon black (fumed silicon dioxide), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa for dehydration...

Embodiment 3

[0041](1) Preparation of modified thermally conductive filler: Add 200 parts by mass of aluminum nitride with a particle size of 5 μm and 8 parts by mass of silane coupling agent KH-550 into a stainless steel reaction kettle, and vacuumize to a degree of 0.1 MPa. Close all the inlets and outlets on the high-pressure reactor, heat the mixed material and stir at a low speed, the speed is 100r / min, the heating temperature is 220°C, and the time is 3 hours to obtain a modified thermally conductive filler;

[0042] (2) In terms of parts by mass, 100 parts of methyl vinyl silicon raw rubber with a vinyl molar content of 0.3% and a viscosity of 10000 cps at 25°C, 208 parts of modified thermally conductive fillers obtained in step (1), and 30 parts White carbon black (fumed silicon dioxide), 30 parts of vinyl-terminated silicone oil with a vinyl molar content of 5% and a viscosity of 500 cps at 25°C were added to a vacuum kneader at a temperature of 120°C and a vacuum of 0.06MPa for de...

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Abstract

The invention belongs to the technical field of silicone rubber, and discloses a low-temperature vulcanized thermally conductive silicone rubber and a preparation method thereof. The silicone rubber comprises the following components in parts by weight: 100 parts of vinyl silicone raw rubber, 20-40 parts of diluent, 123-208 parts of modified thermally conductive filler, 30-40 parts of white carbon black, and 1-3 parts of hydrogen-containing silicone oil part, 0.1-0.3 part of platinum catalyst and 0.01-0.2 part of inhibitor. The preparation method is as follows: blending vinyl silicone raw rubber, modified thermal conductive filler, white carbon black and diluent to obtain component A; adding component A to the drum of a double-roll mill, and adding the component A after wrapping the rolls. Hydrogen silicone oil, platinum catalyst and inhibitor are mixed, and the mixed rubber is thinned to obtain low-temperature vulcanized thermally conductive silicone rubber. The present invention uses a special process to modify the thermally conductive filler, and optimizes the addition amount of the modified thermally conductive filler, so that the thermally conductive silicone rubber of the present invention has good thermal conductivity and mechanical properties.

Description

technical field [0001] The invention belongs to the technical field of silicone rubber, and in particular relates to a low-temperature vulcanized heat-conducting silicone rubber and a preparation method thereof. Background technique [0002] With the development of science and technology, people's demand and requirements for electronic products are getting higher and higher, and electronic products are developing in the direction of integration, miniaturization, high performance, energy saving, environmental protection and safety. With the high integration of electronic products, the heat generated per unit volume continues to increase, and heat dissipation will inevitably become a factor that limits its development. Therefore, the development of high thermal conductivity and heat dissipation materials with appropriate viscosity, strong adaptability and low price has become a common concern in the fields of electronic appliances and materials. [0003] Filling various inorg...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08K9/06C08K3/22C08K3/38C08K3/28C08K3/34C08K3/36
Inventor 袁文辉肖强强李莉
Owner SOUTH CHINA UNIV OF TECH
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