A kind of tiw film layer corrosion method
A technology of film layer and corrosion solution, which is applied in the direction of coating, metal material coating process, ion implantation plating, etc., can solve the problems affecting the corrosion effect of TiW film layer, affecting the production yield and production efficiency of multilayer film products , to achieve the effect of guaranteeing corrosion effect, facilitating production operation and improving stability
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Embodiment 1
[0053] The continuous sputtering method is used to generate TaN, TiW, Ni, and Au in order to form a multi-layer thin film (TaN)-TiW-Ni-Au film system, and then use a mask photolithography method to uniformly coat the film substrate Glue, exposure, development, followed by etching the Au layer, Ni layer according to the conventional process, then the TiW layer, and finally the TaN layer according to the conventional process to obtain the required circuit pattern, such as figure 1 Shown is the corrosion process diagram of the present invention for the TaN-TiW-Ni-Au multilayer film structure.
[0054] The TiW film is obtained by a magnetron sputtering method, and the target is a TiW alloy target, in which 10% of Ti and 90% of W are uniformly mixed, and the film thickness is 500 angstroms.
[0055] The volume ratio of hydrogen peroxide, ammonia and phosphoric acid is: hydrogen peroxide: ammonia: phosphoric acid=65ml:28ml:6ml.
[0056] The mass concentration of hydrogen peroxide is 40%, t...
Embodiment 2
[0060] The continuous sputtering method is used to generate TaN, TiW, Ni, and Au in order to form a multi-layer thin film (TaN)-TiW-Ni-Au film system, and then use a mask photolithography method to uniformly coat the film substrate Glue, exposure, development, followed by etching the Au layer, Ni layer according to the conventional process, then the TiW layer, and finally the TaN layer according to the conventional process to obtain the required circuit pattern, such as figure 1 Shown is the corrosion process diagram of the present invention for the TaN-TiW-Ni-Au multilayer film structure.
[0061] The TiW film is obtained by a magnetron sputtering method, and the target is a TiW alloy target, in which 10% of Ti and 90% of W (mass percentage content) are uniformly mixed, and the film thickness is 500 angstroms.
[0062] The volume ratio of hydrogen peroxide, ammonia, and phosphoric acid is: hydrogen peroxide: ammonia: phosphoric acid=65ml:25ml:5ml.
[0063] The mass concentration of ...
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