Unlock instant, AI-driven research and patent intelligence for your innovation.

Curable resin composition, dry film, cured product and printed wiring board

A technology of curable resin and composition, applied in printed circuit parts, circuit board materials, instruments, etc., can solve problems such as deterioration of developability, and achieve the effect of excellent dryness to touch

Active Publication Date: 2015-09-23
TAIYO HLDG CO LTD
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, an inorganic filler is usually blended into a solder resist composition, but if a substance with a high specific gravity is used as the inorganic filler, or if a large amount of the inorganic filler is added to the composition, the developability may deteriorate, which becomes a problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Curable resin composition, dry film, cured product and printed wiring board
  • Curable resin composition, dry film, cured product and printed wiring board
  • Curable resin composition, dry film, cured product and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0098] Hereinafter, the present invention will be described in further detail by using examples.

[0099] According to the formulation shown in the following table, each component was blended, premixed with a mixer, dispersed and kneaded with a three-roll mill, and each composition was prepared. In addition, the compounding quantity in a table shows a mass part.

[0100]

[0101] (Synthesis example of varnish A)

[0102]In 600 g of diethylene glycol monoethyl ether acetate, drop into o-cresol novolac type epoxy resin (EPICLON N-695 manufactured by Dainippon Ink Chemical Industry Co., Ltd., 95° C. of softening point, 214 epoxy equivalents, average number of functional groups 7.6) 1070 g (number of glycidyl groups (total number of aromatic rings): 5.0 mol), 360 g (5.0 mol) of acrylic acid and 1.5 g of hydroquinone were heated to 100° C. and stirred to dissolve uniformly. Next, 4.3 g of triphenylphosphine was thrown in, heated to 110° C. and reacted for 2 hours, then heated u...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
softening pointaaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

The invention provides a curable resin composition which has excellent alkali developable performance, soldering heat resistance, storage stability, color change resistance to heat and light and touch-dry performance, a dry film, a cured product and a printed wiring board. The curable resin composition contains (A) carboxyl-containing resin, (B) a photo-polymerization initiator, (C) 1,3,5-triglycidyl isocyanurate formed from beta bodies only, the beta bodies having a structure of bonding 3 epoxy groups in the same direction relative to a triazine ring skeleton surface, and (D) inorganic filler. Relative to 1 equivalent of carboxyl contained in the (A) carboxyl-containing resin, the equivalent ratio of epoxy groups in the (C) 1,3,5-triglycidyl isocyanurate is less than 2.0.

Description

technical field [0001] The present invention relates to a curable resin composition (hereinafter also simply referred to as "composition"), a dry film, a cured product, and a printed circuit board. objects and printed circuit boards. Background technique [0002] Usually, printed circuit boards are etched to remove unnecessary portions of copper foil bonded to laminated boards to form circuit wiring, and electronic components are arranged at predetermined positions by soldering. In such a printed circuit board, as a protective film for preventing the adhesion of solder to the necessary parts and preventing the conductors of the circuit from being exposed to corrosion due to oxidation and moisture, the connection hole is removed from the substrate on which the circuit pattern is formed. A solder resist layer is formed in the area. Since the solder resist layer also functions as a permanent protective film for the circuit board, various properties such as alkali developabili...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/004G03F7/09H05K1/02
CPCC08J5/18C08K3/013C08K5/1515C08K5/34926C08L33/068H05K1/03
Inventor 加藤贤治今野清依田爱子中岛孝典
Owner TAIYO HLDG CO LTD