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Method of protecting part of a silicon dioxide film on the surface of a silicon chip by using a blue film

A technology of silicon dioxide film and silicon wafer surface, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of silicon wafer surface damage and low efficiency, so as to improve production efficiency, reduce costs, and reduce contamination. Effects of dirt and damage

Active Publication Date: 2015-10-07
MCL ELECTRONICS MATERIALS
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AI Technical Summary

Problems solved by technology

This method has a certain damage to the surface of the silicon wafer due to the use of a sharp thimble to pierce the surface of the silicon wafer, and the efficiency is low.

Method used

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Examples

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Embodiment Construction

[0022] The present invention will be further elaborated below in conjunction with specific embodiments. The blue film used in the present invention is a commercially available blue PVC film.

[0023] The method for using the blue film to protect a part of the silicon dioxide film on the surface of the silicon wafer comprises the following steps:

[0024] 1) Form a layer of silicon dioxide film on the surface of the silicon wafer by chemical vapor deposition, and then determine which parts of the silicon dioxide film need to be retained. After determining, cut the blue film into the shape of the part of the silicon dioxide film to be retained Shapes of exactly the same size, and then use acrylic as an adhesive to adhere the cut blue film to the silicon dioxide film that needs to be protected, while the silicon dioxide film that does not need to be protected on the surface of the silicon wafer does not adhere to the blue film;

[0025] 2) Put the silicon wafer pasted with the b...

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PUM

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Abstract

Provided is a method of protecting part of a silicon dioxide film on the surface of a silicon chip by using a blue film. An acrylic acid sticker blue film is utilized to serve as a blue film for protecting a silicon dioxide layer, the redundant silicon dioxide layer is removed through corrosion of hydrogen fluoride and then the remaining silicon dioxide layer is immersed into an ammonium hydroxide solution that is usually used for cleaning a semiconductor, and the blue film is automatically separated from the surface of the silicon chip after a certain period of time. The blue film removing method is easy to operate, films can be removed in batch, and the production efficiency is greatly improved. No workers participate in the blue film removing operations, so the silicon chip is prevented from being contaminated and damaged by workers. Meanwhile, blue film glue that remains on the surface of the silicon chip can all be removed during the blue film removing process, the operations are reduced, and the costs are cut.

Description

technical field [0001] The invention relates to a method for protecting a silicon dioxide film at a specific position on the surface of a silicon chip in the field of semiconductor material processing, in particular to a method for using a blue film to protect a part of the silicon dioxide film on the surface of a silicon chip. Background technique [0002] There are many processes of using blue film in the process of semiconductor material processing, such as the use of blue film to protect the silicon dioxide layer in the back sealing technology of silicon polished wafer processing technology; in the device processing process, the blue film is covered on the wafer of the device Surface, to ensure that the surface of the wafer is not scratched during the subsequent circulation process. [0003] Chemical vapor deposition technology is used to deposit a layer of silicon dioxide film on the back of the silicon wafer to prevent doping impurities from the substrate from being in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
CPCH01L21/48
Inventor 苗利刚史舸邓德翼王文卫焦二强李战国
Owner MCL ELECTRONICS MATERIALS
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