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Composite thin film and manufacturing method, organic light emitting diode and packaging method

A technology of light-emitting diodes and composite thin films, which is applied in the direction of organic semiconductor devices, semiconductor/solid-state device manufacturing, coating, etc., can solve the problems that organic light-emitting diodes and thin films cannot be prepared separately, achieve good results, firm packaging, and simplify the production process Effect

Active Publication Date: 2015-10-07
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The invention provides a thin film and its preparation method, an organic light emitting diode and its preparation method, which solves the problem that the organic light emitting diode and the thin film cannot be prepared separately in the prior art

Method used

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  • Composite thin film and manufacturing method, organic light emitting diode and packaging method
  • Composite thin film and manufacturing method, organic light emitting diode and packaging method
  • Composite thin film and manufacturing method, organic light emitting diode and packaging method

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Embodiment approach

[0061] comprising at least three PDDA layers and at least three graphene oxide layers;

[0062] PDDA layers and graphene oxide layers are alternately deposited, and the last deposited layer is a graphene oxide layer.

[0063] Because graphene has good water and oxygen barrier properties, graphene is traditionally used as a packaging material, but the preparation, processing, and transfer processes of graphene are complicated, and it is not suitable for large-scale use, let alone industrial production. In this application, graphene oxide is used as the packaging material. The graphene oxide layer is easy to prepare and process, and is suitable for industrial production, but according to figure 1 It can be seen from the schematic diagram of the micro-fragment structure of graphene oxide that although the main body of graphene oxide still maintains the ring structure of graphene, it can penetrate water molecules and Oxygen molecules, resulting in reduced water and oxygen resista...

Embodiment 1

[0095]According to the preparation method of the composite film of the present invention, the PET film is selected as the base film, and the base film pretreatment step is first carried out: the first side of the base film is irradiated with oxygen plasma, so that the first side of the base film produces negative oxygen ions; Deposition step: deposit the pretreated PET film in PDDA electrolyte solution, deposit the PET film deposited with PDDA layer in the dispersion of graphene oxide, and repeat the above deposition operation until three layers are deposited on the base film. Layer PDDA layer and three layers of graphene oxide layers, and the last deposited layer is a graphene oxide layer; finally carry out the self-assembly step: the PET film deposited with the graphene oxide layer is placed in the solution of the compound shown in formula I to soak, so that The compound shown in formula I is self-assembled on the graphene oxide layer. The concentration of the methanol soluti...

Embodiment 2

[0097] According to the preparation method of the composite film of the present invention, the base film is a PET film, and the base film pretreatment step is first carried out: the first side of the PET film is irradiated with oxygen plasma, so that the first side of the base film produces negative oxygen ions; then electrostatic deposition is carried out Steps: place the pretreated PET film in PDDA electrolyte solution for deposition, place the PET film deposited with PDDA layer in the dispersion of graphene oxide for deposition, and cycle through the above deposition operations until the base film is deposited with Four layers of PDDA layers and four layers of graphene oxide layers, and the last deposited layer is a graphene oxide layer; the last self-assembly step: the PET film deposited with the graphene oxide layer is placed in the solution of the compound shown in formula I to soak, The compound shown in formula I is self-assembled on the graphene oxide layer, the concen...

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Abstract

The invention discloses a composite thin film and a manufacturing method, an organic light emitting diode and a packaging method. The composite thin film comprises a substrate film, a PDDA layer deposited on the first face of the substrate film, a graphene oxide layer deposited on the PDDA layer, and a monomolecular layer arranged on the surface of the graphene oxide layer in a self-assembly mode and composed of a compound as shown in a formula I. The composite thin film manufacturing method comprises a self-assembly step in which the substrate film deposited with the graphene oxide layer is placed in a solution of the compound as shown in the formula I for immersion, and the compound as shown in the formula I is arranged on the graphene oxide layer in a self-assembly mode. The organic light emitting diode is packaged by adopting the composite thin film of the invention. The organic light emitting diode packaging method comprises a polymer deposition step and a packaging step.

Description

technical field [0001] The invention relates to the field of packaging of organic light emitting diodes, in particular to a composite thin film and a preparation method thereof, as well as an organic light emitting diode and a packaging method thereof. Background technique [0002] Water and oxygen are the natural enemies of OLEDs. They can not only open the unsaturated bonds of polymers to accelerate the aging of organic materials, but also cause damage to the electrodes in OLEDs. Therefore, the packaging level of OLEDs determines their lifetime and reliability to the environment. [0003] Ultraviolet encapsulation is a relatively common encapsulation method in the laboratory. It is low in cost and easy to operate. However, ultraviolet glue will come into contact with organic light-emitting diodes during curing, causing adverse effects on them and cannot be used in actual industries. [0004] The glass (Frit) encapsulation method is an encapsulation method in which the enc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/54H01L51/52H01L51/50H10K99/00
CPCH10K71/00H10K59/873B29C41/006C08G63/916H10K2102/00H10K50/844H10K50/8445H10K59/40
Inventor 冯翔刘静魏向东邱云
Owner BOE TECH GRP CO LTD
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