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Radiation-sensitive resin composition and electronic part

A resin composition, radiation-sensitive technology, applied in the processing of photosensitive materials, photosensitive materials for opto-mechanical equipment, instruments, etc., can solve the problems of low exposure sensitivity of resin films, and achieve excellent shape retention and high exposure sensitivity. Effect

Active Publication Date: 2019-06-04
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the radiation-sensitive resin composition described in this patent document 1, although a resin film having high transparency after firing in an oxidizing gas atmosphere can be obtained, the obtained resin film has low exposure sensitivity to radiation. Therefore, From the point of view of improving productivity, there is room for improvement

Method used

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  • Radiation-sensitive resin composition and electronic part
  • Radiation-sensitive resin composition and electronic part
  • Radiation-sensitive resin composition and electronic part

Examples

Experimental program
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Effect test

preparation example Construction

[0138] The preparation method of the radiation-sensitive resin composition of the present invention is not particularly limited, and each component constituting the radiation-sensitive resin composition may be mixed by a known method.

[0139] The method of mixing is not particularly limited, but it is preferable to mix a solution or a dispersion obtained by dissolving or dispersing each component constituting the radiation-sensitive resin composition in a solvent. Thus, a radiation-sensitive resin composition is obtained in the form of a solution or a dispersion.

[0140] A method for dissolving or dispersing each component constituting the radiation-sensitive resin composition in a solvent may follow a conventional method. Specifically, a method of stirring using a stirrer and a magnetic stirrer; a method of using a high-speed homogenizer, a disperser, a planetary mixer, a twin-screw mixer, a ball mill, a three-roll mill, and the like can be used. In addition, after dissolv...

Embodiment 1

[0196] With 291 parts (100 parts in terms of cyclic olefin polymer (A1a)) of the polymer solution (100 parts based on cyclic olefin polymer (A1a)) obtained in the synthesis example 1 of binder resin (A) of the cyclic olefin polymer (A1a), as the radiation-sensitive compound ( B) 1,1,3-tris(2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane (1 mole) with 1,2-naphthoquinonediazide-5-sulfonyl chloride (2.5 moles) of condensate (B1) 40 parts, epoxidized butane tetracarboxylic acid tetrakis (3-cyclohexenylmethyl) modified ε-caprolactone (aliphatic ring) as crosslinking agent (C) 40 parts of functional epoxy resin, trade name "EPOLEAD GT401", manufactured by Daicel Chemical Industry Co., Ltd.), 3,4-epoxycyclohexenylmethyl-3' as crosslinking agent (C) , 10 parts of 4'-epoxycyclohexene carboxylate (trade name "Celloxide 2021P", manufactured by Daicel Chemical Industry Co., Ltd.), as a sulfur-free semi-hindered phenol antioxidant and / or a sulfur-free less hindered phenol 3,9-bis[2-{3-(3-te...

Embodiment 2～42

[0199] Except that when preparing the radiation-sensitive resin composition, each compound shown in Table 1-Table 3 was used in the compounding amount shown in Table 1-Table 3, a radiation-sensitive resin composition was prepared and carried out in the same manner as Example 1. the same evaluation. The results are shown in Tables 1 to 3.

[0200] In addition, in Table 1 - Table 3, each compound is as follows.

[0201] · "Cyclic olefin polymer (A1b)" is the cyclic olefin polymer (A1b) obtained in Synthesis Example 2.

[0202] - "Acrylic resin (A2)" is the acrylic resin (A2) obtained by the synthesis example 3.

[0203] - "Cardo resin (A3)" is the cardo resin (A3) obtained in the synthesis example 4.

[0204] - "polysiloxane (A4)" is the polysiloxane (A4) obtained in the synthesis example 5.

[0205] "Radiation-sensitive compound (B2)" is 1,1,3-tris(2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane (1 mole) and 1,2-naphthoquinone Condensate of azide-5-sulfonyl chloride (2 mol) ...

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Abstract

Provided is a radiation-sensitive resin composition which contains (A) a binder resin, (B) a radiation-sensitive compound, (C) a crosslinking agent, (D) a sulfur-free semi-hindered phenolic antioxidant and / or a sulfur-free less-hindered phenolic antioxidant, and (E) a sulfur-containing phenolic antioxidant. The present invention is able to provide a radiation-sensitive resin composition which is capable of providing a resin film that has high exposure sensitivity and excellent shape retention performance after firing, while exhibiting high transparency even after being fired in an oxidizing atmosphere.

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition, and an electronic component provided with a resin film formed from the radiation-sensitive resin composition, and more specifically, to an electronic component capable of obtaining high exposure sensitivity, excellent shape retention after firing, and high oxidation resistance. A radiation-sensitive resin composition having a highly transparent resin film even after being fired in a gas atmosphere, and an electronic component including a resin film formed of the radiation-sensitive resin composition. Background technique [0002] In various display elements such as organic EL elements and liquid crystal display elements, integrated circuit elements, solid-state imaging elements, color filters, black matrices, and other electronic components, as a protective film to prevent deterioration and damage, and to make the surface of the element Various resin films are provided, such as a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004C08K5/00C08L101/00G03F7/023G03F7/40
CPCC08K5/13C08K5/28C08K5/375G03F7/0226G03F7/0233G03F7/038G03F7/0757
Inventor 阿部聪堤隆志
Owner ZEON CORP
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