Glass Frit Using Glass Powder With Low Melting Point And Crystalline Ceramic Filler With Low Expansion And Paste Comprising The Same

Abstract

Disclosed are a glass frit using low melting point glass powder with superior durability, sealing reliability, and water resistance which is suitable for an OLED panel sealing, and a low expansion crystalline ceramic filler which controls a coefficient of thermal expansion, and a paste including the same. According to the present invention, the low melting point glass frit comprises the low melting point glass powder consisting of 0.1-20mol% of V2O5, 30-60mol% of ZnO, 10-30mol% of B2O3, 0.1-10mol% of BaO, 0.1-10mol% of SiO2, 0.1-15mol% of TeO2, and 2-20mol% of at least one of CuO, Fe2O3, and Co3O4; and less than 70 parts by weight of low expansion crystalline ceramic filler with respect to 100 parts by weight of the low melting point glass powder.

Description

technical field [0001] The present invention relates to a low-melting-point glass frit (Glass Frit), and in more detail, relates to a low-melting-point glass frit suitable for sealing organic light-emitting diode (OLED) panels with excellent durability, sealing reliability, and water resistance. A low-expansion crystalline ceramic filler glass frit for adjusting thermal expansion coefficient and a paste containing the low-melting glass frit. Background technique [0002] Organic Light Emitting Diode (OLED, Organic Light Emitting Diode) can be driven at low voltage, can be made thin, and has a wide viewing angle and fast response speed, so it is designated as the current alternative to the dominant flat panel display The most powerful candidate for liquid crystal display (LCD, Liquid Crystal Display) in the device market. Organic light-emitting diodes can be applied not only to display devices, but also to lighting and various sensors, so their market potential is very wide....

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Problems solved by technology

[0005] In order to solve the above-mentioned problems, a low-melting-point glass frit (Glass Frit) mixed with a low-melting-point glass powder and a low-expansion crystalline ceramic powder as a filler is used as a sealing material. In the case of low-melting-point glass frit for LED sealing, there are problems such as deterioration in the oxygen atmosphere, or deterioration of adhesion (reliable sealing) after sealing due to a large difference in the coefficient of thermal expansion (Coefficient of Thermal Expansion; CTE) between the substrate and the substrate. property) is reduced, or due to the low melting point glass powder containing P 2 o 5 , resulting in poor water resistance

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