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Dual-cylindrical MIM surface plasmon waveguide structured acceleration sensing device

A surface plasmon wave and acceleration sensing technology, applied in the field of sensors, can solve the problems of long response time and low sensitivity

Inactive Publication Date: 2015-10-14
GUANGXI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This device can not only make up for the shortage of MEMS sensors limited by the external environment and their own properties, but also improve the problems of long response time and low sensitivity of traditional micro-ring sensors. This device has a simple structure and is easy to implement.

Method used

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  • Dual-cylindrical MIM surface plasmon waveguide structured acceleration sensing device

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Embodiment

[0018] refer to figure 1 , an acceleration sensing device with a dual cylindrical MIM surface plasmon waveguide structure, comprising a Si substrate 1, and also comprising

[0019] A first MIM waveguide structure 3 and a second MIM waveguide structure 4 of the same size, the MIM waveguide structure is a cylindrical MIM waveguide structure; the first MIM waveguide structure 3 and the second MIM waveguide structure 4 are arranged on the Si substrate 1 ;

[0020] An optical fiber straight waveguide 2, the optical fiber straight waveguide 2 is arranged on the Si substrate 1, the first MIM waveguide structure 3 and the second MIM waveguide structure 4 are symmetrically arranged on both sides of the optical fiber straight waveguide 2, and are connected to the optical fiber straight waveguide 2 Dock.

[0021] The cylindrical MIM waveguide structure is a symmetrical gold-silicon dioxide-gold surface plasmon waveguide.

[0022] The optical fiber straight waveguide 2 is formed by one...

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PUM

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Abstract

The invention discloses a dual-cylindrical MIM surface plasmon waveguide structured acceleration sensing device. The acceleration sensing device comprises a Si substrate. The acceleration sensing device is characterized in that the acceleration sensing device further comprises a first MIM waveguide structure and a second MIM waveguide structure which are in the same size, as well as an optical fiber straight waveguide; the MIM waveguide structures are cylindrical MIM waveguide structures; the first MIM waveguide structure and the second MIM waveguide structure are arranged on the Si substrate; the optical fiber straight waveguide is arranged on the Si substrate; the first MIM waveguide structure and the second MIM waveguide structure are symmetrically arranged at two sides of the optical fiber straight waveguide, and abut against the optical fiber straight waveguide; and the cylindrical MIM waveguide structures are symmetric gold-silicon dioxide-gold surface plasmon waveguides. With the device of the invention adopted, a defect that an MEMS sensor is limited by external environment and attributes of the MEMS sensor itself can be eliminated, and problems such as long response time and low sensitivity of a traditional micro ring sensor can be solved. The device of the invention has the advantages of simple structure and easiness in implementation.

Description

technical field [0001] The invention relates to sensor technology, in particular to an acceleration sensing device with a double-cylindrical MIM surface plasmon waveguide structure. Background technique [0002] Micro Optical Electro Mechanical System (MOEMS for short) is a very dynamic new technology system developed in recent years. micro-optical structure system. In addition to being able to inherit the mature manufacturing process of Micro-Electro-Mechanical System (MEMS), MOEMS can combine various MEMS structures with micro-optical devices, optical resonators, optical waveguides, semiconductor lasers, photodetection devices, etc. fully integrated. As one of the key sensor devices in high-tech fields such as aerospace, smart cars, smart electronic products (smart phones, computers, etc.), robots, and high-tech weapons, the acceleration sensor detects the electrical conductivity, mechanical properties or temperature properties of sensitive unit materials. to detect ...

Claims

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Application Information

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IPC IPC(8): G01P15/03
Inventor 秦柳丽朱君宋树祥傅得立
Owner GUANGXI NORMAL UNIV
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