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Co-modified LDS (Laser Direct Structuring) additive and polyarylester composition containing same

A technology of co-modification and additives, applied in the field of co-modified LDS additives, can solve problems such as weak adhesion of metal films

Inactive Publication Date: 2015-10-21
刘帅
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the adhesion of the metal film on the plastic parts prepared in the prior art is not strong, although the 100-grid test of most of the metal film is basically 4-10%, but as the environment of the metal film becomes more and more Harsh, manufacturers have strict requirements on scrap rate, consumers have strict requirements on quality, the adhesion of metal films needs to pass various complex and strict tests, and the existing LDS materials cannot meet this requirement

Method used

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  • Co-modified LDS (Laser Direct Structuring) additive and polyarylester composition containing same
  • Co-modified LDS (Laser Direct Structuring) additive and polyarylester composition containing same
  • Co-modified LDS (Laser Direct Structuring) additive and polyarylester composition containing same

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Embodiment approach

[0064] As an embodiment of the present invention, the mass ratio of the carboxyl-containing modified compound to the hydroxyl-containing modified compound in the present invention is 1:0.5-2.

[0065] As an embodiment of the present invention, the co-modified LDS additive of the present invention further includes 1-10 parts by weight of metal hydroxide, and the metal hydroxide partially covers the surface of the laser-sensitive compound.

[0066] As an embodiment of the present invention, the mass ratio of the metal hydroxide to the hydroxyl-containing modified compound in the present invention is 1:3-5.

[0067] As an embodiment of the present invention, the particle size of the laser-sensitive compound described in the present invention is 1-50 microns.

[0068] As an embodiment of the present invention, the preparation method of co-modified LDS additive comprises the following steps:

[0069] S10, ultrasonically dispersing 100 parts by weight of the laser-sensitive compoun...

Embodiment 1

[0076] Embodiment 1. Co-modified LDS additives, including 100 parts by weight of laser sensitive compounds and 10-30 parts by weight of modified compounds containing hydroxyl groups, the modified compounds containing hydroxyl groups are partially coated on the surface of the laser sensitive compounds, so The general chemical formula of the laser sensitive compound is XY 2 o 4 , the laser-sensitive compound is an equiaxed crystal system, X and Y are both metal elements, and X and Y are from Group IIIA, Group IB, Group IIB, Group VIB, Group VIIB, or Group VIII of the periodic table of elements;

[0077] The chemical structural formula of the modified hydroxyl-containing compound is as follows:

[0078]

[0079] The m is an integer of 0-5, X is a monovalent group with a hydroxyl group or a hydroxyl group, and the position of X on the pyridine ring is the ortho, meta or para position of the sulfonic acid group.

Embodiment 2

[0080] Embodiment 2. is identical with embodiment 1, and difference is that co-modification LDS additive also comprises carboxyl-containing modified compound, and the chemical structural formula of described carboxyl-containing modified compound is as follows:

[0081]

[0082] The m is an integer of 0-5, X is a monovalent group with a carboxyl group or a carboxyl group, and the position of X on the pyridine ring is the ortho, meta or para position of the sulfonic acid group.

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Abstract

The invention relates to a co-modified LDS (Laser Direct Structuring) additive. The co-modified LDS additive comprises the following components in parts by weight: 100 parts of laser-sensitive compound and 10 to 30 parts of modified compound containing hydroxyl groups and modified compound containing carboxyl groups, wherein the modified compound containing the hydroxyl groups is partially coated on the surface of the laser-sensitive compound; the general chemical formula of the laser-sensitive compound is XY2O4; the laser-sensitive compound is an isometric system, both X and Y are metallic elements and are from group IIIA, group IB, group IIB, group VIB, group VIIB or group VIII in the periodic table of chemical elements; and a metal thin film on a plastic product prepared from the co-modified LDS additive has good adhesive force.

Description

technical field [0001] The invention relates to a co-modified LDS additive, a modification method of the LDS additive, and a composition containing the LDS additive. Background technique [0002] Laser direct structuring (LDS) technology refers to the use of computer to control the laser scanning area, irradiate the laser light on the workpiece containing laser sensitive additives, activate the circuit pattern, and the activated area on the workpiece can be electroless electroless plating Deposit metals such as copper, nickel, gold, etc., so as to realize the manufacture of conductive patterns on three-dimensional plastic parts. [0003] With the rapid development of Laser Direct Structuring (LDS) technology, the production speed of Molded Interconnect Device (Moulded Interconnect Device) is faster, the process is more simplified, the cost is more controllable, and the application field is wider. Its biggest advantage is that it can Reduce the component count of electronic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/10C08K3/22C08K5/42C08L67/00
Inventor 刘帅
Owner 刘帅