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A kind of high temperature resistant thermally conductive insulating adhesive material and preparation method thereof

A heat-conducting, insulating, high-temperature-resistant technology, used in adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., can solve the problems of poor thermal conductivity, high toxicity, low mechanical properties, etc. The effect of high impact strength and high safety performance

Active Publication Date: 2017-05-24
广东道氏陶瓷材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, people placed a layer of insulating medium between the heating element (power tube) and the radiator as a heat-conducting material, such as: mica sheet, polyester film, polytetrafluoroethylene, and beryllium oxide ceramics, which played a certain role, but also There are disadvantages such as poor thermal conductivity, low mechanical properties, and high toxicity

Method used

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  • A kind of high temperature resistant thermally conductive insulating adhesive material and preparation method thereof

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Effect test

Embodiment 1

[0023] A high-temperature-resistant heat-conducting insulating adhesive material, which is made of the following raw materials according to the following weight ratio: 13.9 parts of epoxy resin Eponol 53J-32, 5 parts of hydroxyl silicone resin (organic silicon segment content 20-60%), butyl 4.2 parts of nitrile rubber, 0.07 parts of polyvinyl butyral resin Butvar-B-72, 7.7 parts of bisphenol A diglycidyl ether, 1 part of acid anhydride, 4,4'-diamino-3,3'-dichlorodi 1.7 parts of benzene methane, 59 parts of aluminum oxide, 0.2 parts of dibutyl hydroxytoluene, 0.03 parts of m-chloroaniline, 1.5 parts of tripropylene glycol diacrylate, 0.6 parts of dioctyl terephthalate, 2.5 parts of acetone, N,N - 2.6 parts of dimethylformamide.

Embodiment 2

[0025] A high-temperature-resistant heat-conducting insulating adhesive material, which is made of the following raw materials according to the following weight ratio: 15 parts of epoxy resin Eponol 53J-32, 8 parts of hydroxyl silicone resin (organic silicon segment content 20-60%), butyl 4.5 parts of nitrile rubber, 0.1 parts of polyvinyl butyral resin Butvar-B-72, 7.75 parts of bisphenol A diglycidyl ether, 4 parts of anhydride, 4,4'-diamino-3,3'-dichlorodi 1.8 parts of benzene methane, 50 parts of aluminum oxide, 0.2 parts of dibutyl hydroxytoluene, 0.05 parts of p-chloroaniline, 2 parts of tripropylene glycol diacrylate, 0.8 parts of dioctyl terephthalate, 3 parts of acetone, N,N - 2.8 parts of dimethylformamide.

Embodiment 3

[0027] A heat-resistant heat-conducting insulating adhesive material, made of the following raw materials according to the following weight ratio: 14.6 parts of epoxy resin NPEB-450A80, ​​10 parts of hydroxyl silicone resin (organic silicon segment content 20-60%), nitrile 3.5 parts of rubber, 0.05 parts of polyvinyl butyral resin Butvar-B-72, 5.9 parts of bisphenol A diglycidyl ether, 2 parts of acid anhydride, 4,4'-diamino-3,3'-dichlorodiphenyl 2.5 parts of methane, 55 parts of aluminum oxide, 0.1 part of dibutyl hydroxytoluene, 0.01 part of m-chloroaniline, 1 part of tripropylene glycol diacrylate, 0.34 parts of dioctyl terephthalate, 2.5 parts of acetone, N,N- 2.5 parts of dimethylformamide.

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Abstract

The present invention discloses a high-temperature-resisting heat-conducting insulating rubber material and a preparation method therefor. The high-temperature-resisting heat-conducting insulating rubber material is mainly prepared from 12-15 parts of epoxy resin, 5-10 parts of organic silicon resin, 3-5 parts of butadiene-acrylonitrile rubber, 0.05-0.1 part of polyvinyl butyral resin, 5-9 parts of an epoxy active diluting agent, 0.5-5 parts of anhydride, 1-3 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 50-60 parts of heat-conducting fillers, 0.1-0.2 part of an antioxidant, 0.01-0.05 part of a curing agent, 1-2 parts of a double-functional-group active diluting agent, 0.3-1 part of a plasticizer and 4-6 parts of a solvent. The high-temperature-resisting heat-conducting insulating rubber material prepared by the method has high splicing performance and high insulating performance; after the high-temperature-resisting heat-conducting insulating rubber material is cured, the impact-resistance strength is high; meanwhile, a cured product has good heat-conducting and heat-dissipating functions and can be used at 150-200 DEG C for a long period; and no gas is discharged in a curing process so that the safety performance is high.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high-temperature-resistant heat-conducting insulating adhesive material. Background technique [0002] With the development of large-scale integrated circuits and micro-encapsulation technology, the volume of electronic components and logic circuits has been reduced by tens of millions of times, so the requirements for their heat dissipation and insulation are correspondingly higher and higher. It will directly affect the life and reliability of various high-precision equipment using them. In the past, people placed a layer of insulating medium between the heating element (power tube) and the radiator as a heat-conducting material, such as: mica sheet, polyester film, polytetrafluoroethylene, and beryllium oxide ceramics, which played a certain role, but also There are disadvantages such as poor thermal conductivity, low mechanical properties, and high to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J183/00C09J109/02C09J11/06C09J11/04
Inventor 王韬谭星
Owner 广东道氏陶瓷材料有限公司