A kind of high temperature resistant thermally conductive insulating adhesive material and preparation method thereof
A heat-conducting, insulating, high-temperature-resistant technology, used in adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., can solve the problems of poor thermal conductivity, high toxicity, low mechanical properties, etc. The effect of high impact strength and high safety performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] A high-temperature-resistant heat-conducting insulating adhesive material, which is made of the following raw materials according to the following weight ratio: 13.9 parts of epoxy resin Eponol 53J-32, 5 parts of hydroxyl silicone resin (organic silicon segment content 20-60%), butyl 4.2 parts of nitrile rubber, 0.07 parts of polyvinyl butyral resin Butvar-B-72, 7.7 parts of bisphenol A diglycidyl ether, 1 part of acid anhydride, 4,4'-diamino-3,3'-dichlorodi 1.7 parts of benzene methane, 59 parts of aluminum oxide, 0.2 parts of dibutyl hydroxytoluene, 0.03 parts of m-chloroaniline, 1.5 parts of tripropylene glycol diacrylate, 0.6 parts of dioctyl terephthalate, 2.5 parts of acetone, N,N - 2.6 parts of dimethylformamide.
Embodiment 2
[0025] A high-temperature-resistant heat-conducting insulating adhesive material, which is made of the following raw materials according to the following weight ratio: 15 parts of epoxy resin Eponol 53J-32, 8 parts of hydroxyl silicone resin (organic silicon segment content 20-60%), butyl 4.5 parts of nitrile rubber, 0.1 parts of polyvinyl butyral resin Butvar-B-72, 7.75 parts of bisphenol A diglycidyl ether, 4 parts of anhydride, 4,4'-diamino-3,3'-dichlorodi 1.8 parts of benzene methane, 50 parts of aluminum oxide, 0.2 parts of dibutyl hydroxytoluene, 0.05 parts of p-chloroaniline, 2 parts of tripropylene glycol diacrylate, 0.8 parts of dioctyl terephthalate, 3 parts of acetone, N,N - 2.8 parts of dimethylformamide.
Embodiment 3
[0027] A heat-resistant heat-conducting insulating adhesive material, made of the following raw materials according to the following weight ratio: 14.6 parts of epoxy resin NPEB-450A80, 10 parts of hydroxyl silicone resin (organic silicon segment content 20-60%), nitrile 3.5 parts of rubber, 0.05 parts of polyvinyl butyral resin Butvar-B-72, 5.9 parts of bisphenol A diglycidyl ether, 2 parts of acid anhydride, 4,4'-diamino-3,3'-dichlorodiphenyl 2.5 parts of methane, 55 parts of aluminum oxide, 0.1 part of dibutyl hydroxytoluene, 0.01 part of m-chloroaniline, 1 part of tripropylene glycol diacrylate, 0.34 parts of dioctyl terephthalate, 2.5 parts of acetone, N,N- 2.5 parts of dimethylformamide.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
