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A method for protecting and sealing holes on the metal coating surface of circuit boards and soldering components
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A metal coating and hole sealing technology, applied in the direction of metal material coating process, etc., can solve the problems of unfavorable circuit boards or welding components welding processing, environmental pollution and other problems
Inactive Publication Date: 2018-04-03
SHENZHEN MAKER TECH CO LTD
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[0005] Aiming at the problems that the metal anti-corrosion processing technology in the prior art is not conducive to the subsequent weldingprocessing of circuit boards or welding components and is likely to cause environmental pollution, the present invention proposes an environmentally friendly circuit board and welding components that have no impact on subsequent welding processing and use. Treatment solution for protecting and sealing holes on the surface of metal plating and its application method
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Embodiment 1
[0031] Using 0.02% of hydroxyethanethiol (carbon number = 2), 0.01% of OP-10 (octylphenol polyoxyethylene ether, C 8 h 17 C 6 h 4 O(CH 2 CH 2 O) n H (n=10), HLB: 13.3-14, cloud point: 68-78°C) and the balance of deionized water to prepare a pretreatment solution, heat the pretreatment solution to 70°C, and put the gold-plated copper test The slices were pretreated by immersing in the pretreatment solution for 1 min.
[0032] The pretreated specimens were immersed in deionized water at 30°C for 10 seconds, taken out, and dried with hot air.
[0033] Immerse the dried specimen in N,O-bistrimethylsilylacetamide and treat it at 30°C for 1min.
[0034] Table 1 shows the test results of the test pieces of the sealing treatment in this embodiment.
Embodiment 2
[0036] Using 2% hydroxybutanethiol (carbon number = 4), 1% NP-9 (nonylphenol ethoxylate, C 9 h 19 C 6 h 4 O(CH 2 CH 2 O) n H (n=9), HLB: 13.3-14, cloud point: 68-78°C) and the balance of deionized water to prepare a pretreatment solution, heat the pretreatment solution to 30°C, and put the silver-plated copper test piece Pretreatment by immersing in an aqueous solution of hydroxyl-terminated alkyl mercaptan for 5 minutes.
[0037] The pretreated specimens were immersed in deionized water at 40°C for 60 seconds, taken out, and dried with hot air.
[0038] Put the dried test piece into N-methyl-N-(tert-butyldimethylsilyl)trifluoroacetamide, and treat it at 70°C for 10 minutes.
[0039] Table 1 shows the test results of the test pieces of the sealing treatment in this embodiment.
Embodiment 3
[0041] Using 1% of hydroxyundecyl mercaptan (carbon number = 11), 5% of AEO-7 (fatty alcoholpolyoxyethylene ether R-O-(CH 2 CH 2 O) n H(R=C 12-18 , n=7), HLB: 12.1, cloud point: ≥50°C) and the balance of deionized water to prepare a pretreatment solution, heat the pretreatment solution to 50°C, and immerse the gold-plated copper test piece into the terminal hydroxyl group Pretreatment in aqueous alkylthiol solution for 3 min.
[0042] The pretreated specimens were immersed in deionized water at 50°C for 50 seconds, taken out, and dried with hot air.
[0043] Put the dried test piece into N-methyl-N-(trimethylsilyl) trifluoroacetamide, and treat it at 60°C for 5 minutes.
[0044] Table 1 shows the test results of the test pieces of the sealing treatment in this embodiment.
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Abstract
The invention provides a method for protecting and sealing holes on the surface of the metalcoating of circuit boards and soldering components and a treatment liquid for protecting and sealing the holes on the surface of the metalcoating. The treatment liquid includes a pre-treatment liquid and a post-treatment liquid; in terms of mass percentage, the pre-treatment liquid includes 0.02-2% of C2-C11 hydroxyl-terminated alkyl mercaptans, 0.01-5% of nonionic surfactants and The balance of ionized water; the post-treatment liquid is a silylating agent. The protective sealing method is as follows: immerse the test piece with metalcoating in the pretreatment solution for pretreatment; wash the pretreated test piece with deionized water and dry it; immerse the dried test piece in the silylating agent post-processing. After the hole sealing treatment by the treatment solution of the present invention, the corrosion resistance of the metal coating is significantly enhanced, and a tightly bonded and strongly hydrophobic organic film is formed on the surface of the metal coating, which has good salt spray resistance and does not affect the welding performance of the metal coating.
Description
technical field [0001] The invention belongs to the technical field of metal surface protection, and in particular relates to a method for sealing holes on the surface of circuit boards and welded components for protection and sealing of holes on the surface of metal coatings and a treatment liquid for the protection and sealing of holes on the surface of metal coatings. Background technique [0002] The copper metal surface of circuit boards and soldered components is susceptible to corrosion and oxidation in the environment. At present, copper metal is often plated with inert metal to increase its corrosion resistance. In general, the inert metal plating processes commonly used in the manufacture of circuit boards and soldered components are the following: nickel / gold plating, nickel / palladium / gold plating, nickel / silver plating, nickel / palladium / gold plating Silver plating etc. [0003] Gold / silver is an inert metal with stable chemical properties and can effectively re...
Claims
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Application Information
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