Tissue engineering full-layer skin and preparing method thereof

A full-thickness skin and tissue engineering technology, applied in medical science, prostheses, etc., can solve problems such as inability to form full-thickness skin and artificial skin

Inactive Publication Date: 2015-11-04
JINAN PANSHENG BIOTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But Apligraf TM Artificial skin is not truly complete skin, and even after transplantation, it cannot form full-thickness skin including skin appendages such as hair, sebaceous glands, etc.

Method used

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  • Tissue engineering full-layer skin and preparing method thereof
  • Tissue engineering full-layer skin and preparing method thereof
  • Tissue engineering full-layer skin and preparing method thereof

Examples

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Embodiment Construction

[0066] The invention discloses a tissue-engineered full-thickness skin and a preparation method thereof. Those skilled in the art can refer to the content of this article and use this method to prepare and obtain the tissue-engineered full-thickness skin and realize its application. In particular, it should be pointed out that all similar replacements and modifications are obvious to those skilled in the art, and they are all considered to be included in the present invention. The tissue-engineered full-thickness skin of the present invention has been described by preferred embodiments, and relevant personnel can obviously carry out the tissue-engineered full-thickness skin, its preparation method and application without departing from the content, spirit and scope of the present invention. Appropriate changes and combinations are used to realize and apply the technology of the present invention.

[0067] The reagents and raw materials used in the tissue-engineered full-thick...

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Abstract

The invention belongs to the technical field of tissue engineering and discloses tissue engineering full-layer skin and a preparing method thereof. The tissue engineering full-layer skin comprises epidermal cells, dermal cells and a biological scaffold material. The skin is obtained by compounding the dermal cells in the biological scaffold material, inoculating the surface with the epidermal cells and carrying out culturing and preparing. The tissue engineering full-layer skin is provided with a dermis layer and an epidermal layer which are provided with activity cells, the epidermal layer contains stratum corneum and is approximate to the normal skin, after transplanting is carried out, complete human skin with a function can be regenerated, the regenerated skin has skin appendant organs such as hair and the sebaceous gland, and the skin can be used for treating skin defects caused by inflammation, ulcer, burns, scalds and the like, and can also be used for preparing a skin model for disease study, medicine testing and screening, cosmetic testing and the like.

Description

technical field [0001] The invention belongs to the technical field of tissue engineering, in particular to a tissue-engineered full-thickness skin and a preparation method thereof. Background technique [0002] Skin is an important tissue covering the body surface and internal organs. It is the barrier between the human body and the external environment. It not only plays the role of protection, secretion, metabolism and sensation, but also participates in immune response and maintains the stability of the internal environment of the body. Inflammation, ulcers, trauma, burns, tumor surgery and congenital deformities often cause skin trauma, which not only affects the appearance but also affects people's quality of life. The current common treatment for these wounds is autologous skin grafting. This method not only creates new wounds in the donor area, but also has limitations such as limited sources of normal skin and low survival rate of grafted skin. Deep and large-area ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61L27/60A61L27/38A61L27/50
Inventor 吴训伟邢志青
Owner JINAN PANSHENG BIOTECH
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