Brazing filler metal for SiC base composite material connection

A technology of composite materials and brazing filler metals, applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc.

Active Publication Date: 2015-11-04
嘉兴睿创新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to overcome the defects of the existing brazing filler metals for welding SiC-based composite

Method used

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  • Brazing filler metal for SiC base composite material connection
  • Brazing filler metal for SiC base composite material connection
  • Brazing filler metal for SiC base composite material connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0038] The present embodiment is the preparation of powdered solder, comprising the following steps:

[0039] (1) According to the composition 4wt% ~ 18wt% Ti or TiH 2 , 2wt% to 10wt% Al, and the rest is Cu. The powders of the three components are weighed, and the purity is higher than 99.0%;

[0040] (2) Put the weighed powder into a container filled with acetone for ultrasonic treatment to make the powder evenly mixed, and then dry at 60° C. to 80° C. to obtain solder powder.

Embodiment approach 2

[0042] The present embodiment is the preparation of powdered solder, comprising the following steps:

[0043] (1) According to the composition 4wt% ~ 18wt% Ti or TiH 2 , 2wt% to 10wt% Al, and the rest is Cu. The powders of the three components are weighed, and the purity is higher than 99.0%;

[0044] (2) Put the powder directly into an agate mortar and grind thoroughly, and mix evenly to obtain brazing material powder.

Embodiment approach 3

[0046] This embodiment is the preparation of paste solder, comprising the following steps:

[0047] (1) dissolving polyvinyl butyral (PVB) in cyclohexanone, so that the concentration is 1wt% to 8wt%, to obtain a uniform oily liquid as a binder;

[0048] (2) Evenly mix the binder with the solder powder obtained in Embodiment 1 or 2 to obtain a solder paste, wherein the additive amount of the binder is 45% to 80% of the weight of the solder.

[0049] Practical effect of solder

[0050] The solder has been used to study the joining of 3D needled C / SiC composites themselves and 3D braided C / SiC composites with niobium alloy (C-103) and metallic niobium. During the brazing process, the vacuum degree is 6×10 -3 Pa, the heating and cooling rate is 10°C / min, and the performance of the brazed joint is as follows.

[0051] (1) Self-connection of 3D needle-punched C / SiC composites

[0052] (1) The three-dimensional acupuncture C / SiC composite material (fiber volume fraction 27% ~ 28%...

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Abstract

The invention relates to brazing filler metal for SiC base composite material connection. The brazing filler metal comprises brazing filler metal powder composed of Cu powder, Ti powder and/or TiH2 powder and Al powder. The brazing filler metal powder comprises 1-10wt% of Al, 4-18wt% of Ti and/or TiH2 and the balanced Cu.

Description

technical field [0001] The invention relates to a brazing filler metal for connecting SiC-based composite materials, in particular to a brazing filler metal for welding SiC-based composite materials containing Cu, Ti and Al. Background technique [0002] SiC-based composite materials, such as C / SiC, SiC / SiC, etc., have the characteristics of low density, high strength, high modulus, high thermal conductivity, radiation resistance, and excellent high-temperature mechanical properties. They are widely used in aerospace, new energy, and transportation. The technical field has broad application prospects. However, in its actual production and use, problems such as preparing components with complex shapes, repairing damaged materials, encapsulating, and combining with heterogeneous materials will all involve the connection of SiC-based composite materials. At present, the connection methods of SiC-based composite materials mainly include mechanical connection, bonding, precursor...

Claims

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Application Information

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IPC IPC(8): B23K35/30
CPCB23K35/302B23K2103/16
Inventor 董绍明陈杰阚艳梅高乐张翔宇
Owner 嘉兴睿创新材料有限公司
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