Extrinsic fiber optic FAP acoustic pressure sensor and processing method based on 45° optical fiber
A sound pressure sensor, extrinsic technology, applied to instruments, measuring ultrasonic/sonic/infrasonic waves, measuring devices, etc., can solve the problems of poor stability of coaxial extrinsic optical fiber FPC cavity sound pressure sensors, etc., to achieve Effect of size reduction and cavity length reduction
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specific Embodiment 1
[0035] This embodiment is a device embodiment of an extrinsic fiber optic FAP acoustic pressure sensor based on a 45° optical fiber.
[0036] The extrinsic fiber-optic fiber-optic acoustic pressure sensor based on the 45° optical fiber of the present embodiment has a structural schematic diagram as figure 1 shown. The sensor includes a silicon support structure 1, an optical fiber 2 with a polished end face of 45° inserted from the side of the silicon support structure 1 against the bottom, a sound pressure sensitive film 3 arranged on the top of the silicon support structure 1, and the silicon support structure 1 The sound pressure sensitive film 3 forms a enamel cavity; the sound pressure sensitive film 3 is a silver film, and the ratio of the diameter of the inscribed circle of the silver film to the thickness is greater than 1000.
specific Embodiment 2
[0037] This embodiment is a device embodiment of an extrinsic fiber optic FAP acoustic pressure sensor based on a 45° optical fiber.
[0038] The extrinsic optical fiber FAP acoustic pressure sensor based on 45° optical fiber in this embodiment is further limited on the basis of the specific embodiment 1 that the thickness of the sound pressure sensitive film 3 is less than 1 micron, and the diameter of the inscribed circle is greater than 1000 microns.
specific Embodiment 3
[0039] This embodiment is an embodiment of a processing method for an extrinsic fiber optic FAP acoustic pressure sensor based on a 45° optical fiber.
[0040] The processing method of the extrinsic fiber optic fiber-optic acoustic pressure sensor based on the 45° optical fiber of the present embodiment, the process flow chart is as follows figure 2 shown. The method includes the following steps:
[0041] Step a, processing the silicon support structure 1 provided with the optical fiber socket;
[0042] Step b, spin coating a positive photoresist 5 on the upper surface of the base 4, and deposit a sound pressure sensitive thin film 3 on the upper surface of the positive photoresist 5 by electron beam deposition, thermal evaporation or magnetron sputtering;
[0043] The steps a and b are carried out synchronously or in any order;
[0044] Step c, pasting the top of the silicon support structure 1 and the sound pressure sensitive film 3 together;
[0045] Step d, using a so...
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