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Phenolic resin foam board, and method for manufacturing same

A technology of phenolic resin and manufacturing method, applied in the direction of injection device, liquid injection device, injection device, etc., can solve the problems of reduced dimensional stability, uneven foaming and curing, etc., and achieve the effect of excellent dimensional stability

Active Publication Date: 2015-11-18
ASAHI KASEI CONSTRUCTION MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is also the following problem: in the thickness direction of the foam, that is, in the vicinity of the surface layer and the inner layer, foaming and solidification occurs unevenly, so the density gradient increases and the dimensional stability after molding decreases. The thicker the board product, the larger the density gradient, so it is sometimes not preferable as a method for manufacturing thick foam board products.

Method used

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  • Phenolic resin foam board, and method for manufacturing same
  • Phenolic resin foam board, and method for manufacturing same
  • Phenolic resin foam board, and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0123] 350 kg of 52% by weight formaldehyde and 251 kg of 99% by weight phenol were put into the reactor, stirred by a helical rotary mixer, and the liquid temperature inside the reactor was adjusted to 40° C. by a temperature regulator. Next, the temperature was raised while adding a 50% by weight aqueous sodium hydroxide solution, and the reaction was performed. When the Oswald viscosity reaches 37 centistokes (=37×10 -6 m 2 / s, measured value at 25°C), the reaction solution was cooled, and 57 kg of urea (corresponding to 15 mol% of the input amount of formaldehyde) was added. Thereafter, the reaction liquid was cooled to 30° C., and the pH was neutralized to 6.4 with a 50% by weight aqueous solution of p-toluenesulfonic acid monohydrate. The viscosity was measured by dehydrating the reaction liquid at 60°C, and the viscosity at 40°C was 13,000 mPa·s. Let this be phenolic resin A-U-1.

[0124] Next, a phenolic resin composition A was obtained by mixing an ethylene oxide-...

Embodiment 2

[0128] A phenolic resin foamed board with a thickness of 100 mm was obtained under the same conditions as in Example 1 except that the temperature of the double conveyor was 78° C., the residence time was 12 minutes, and the oven was aged at 110° C. for 3 hours.

Embodiment 3

[0130] A phenolic resin foamed board with a thickness of 70 mm was obtained under the same conditions as in Example 1, except that the temperature of the double conveyor was 78° C., the residence time was 9 minutes, and the oven was aged at 110° C. for 3 hours.

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Abstract

The present invention provides a phenolic resin foam board, which exhibits sufficient compressive strength and heat conductivity for practical use even when the thickness of the phenolic resin foam board is increased, and which has superior dimensional stability compared with conventional products. The present invention is a phenolic resin foam board which has a board thickness of 40 to 300 mm inclusive. The phenolic resin foam board satisfies the formula 0 ≤ (dave-dmin) / dave ≤ 0.12, where dn represents the density of a nth specimen among n (n ≥ 5) pieces of specimens that are produced by slicing the phenolic resin foam board at almost equal intervals of 8 to 10 mm inclusive in the thickness direction from one main surface of the phenolic resin foam board along the main surface, dave represents the average density of the n pieces of specimens, and dmin represents the lowest density among the densities of the n pieces of specimens. When values for Di = (di+d(i+1)) / 2 are calculated [where i represents an integer of 1 to (n-1)], the Di values are plotted in the order of the numerical values of i (where the horizontal axis indicates the i values and the vertical axis indicates Di values), and points corresponding to the Di values are connected to produce a density distribution curve, there is no straight line that intersects the density distribution curve at four points and is parallel to the horizontal axis.

Description

technical field [0001] The invention relates to a phenolic resin foam board and a manufacturing method thereof. Background technique [0002] The general production method of phenolic resin foam board is to use a foamable phenolic resin composition (hereinafter, sometimes simply referred to as "foamable resin composition") containing a phenolic resin, a foaming agent, a curing catalyst, etc. The dynamic mixer is kneading, and after the mixture is discharged onto the surface material traveling at a certain speed, it is formed into a plate shape between the conveyor belts in the curing furnace. For example, as a method using a plurality of discharge nozzles, there is used a method of supplying the surface material in a linear band at predetermined intervals using a plurality of grooves (Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Application Laid-Open No. 4-141406 [0006] Patent Document 2: Specif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/12
CPCC08J9/36B29C44/30B29C44/461B29C44/5654C08J9/141C08J2201/026C08J2203/142C08J2203/182C08J2361/02B29K2995/0063B05B1/20B05B7/32B29C44/5681C08J2205/052B29K2065/00C08J2203/14C08J2361/10
Inventor 黑田敬之三堀寿北川孝敏
Owner ASAHI KASEI CONSTRUCTION MATERIALS CO LTD
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