Apparatus and methods for defining a plasma
A technology of plasma and equipment, applied in the field of plasma, can solve problems such as unsuitable substrates
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[0114] figure 1 The device shown is placed in the vacuum chamber 1, and the coated substrate 2 to be processed is supplied to the guide located between the coated substrate unfolding (not shown) and the coated substrate rewinding chamber (not shown). On the idle guide rollers 3, 7, the coated substrate 2 passes through the coating chamber 4 during the feeding process, and the coating chamber is formed by an outer packaging body 4', and the outer packaging body 4'is arranged to produce radiation curing The radiation curing material directional beam generating device 5 of the material directional beam 5', and the low-pressure gas plasma source 6 for generating the directional ion current 6'. The directional ion flow can include cations and other positively charged or uncharged particles and species, but only these positively charged ions are the main initiators of the curing or treatment process. The ionization fraction of a typical plasma can be 10 -5 To 10 -1 between. When the...
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