Printed wiring board and semiconductor device provided with same
A printed wiring board, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as large differences in expansion and contraction rates
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no. 1 approach
[0024] like figure 1 As shown, the semiconductor device includes a printed wiring board 10 , a semiconductor package 20 , and various electronic components not shown. These various electronic components and the semiconductor package 20 are mounted on the printed wiring board 10 . The printed wiring board 10 has an insulating substrate 11 and wiring 12 arranged in a predetermined pattern on the insulating substrate 11 . The printed wiring board 10 according to the present embodiment is a multilayer substrate in which wiring 12 is formed in multiple layers. The wirings of different layers are electrically connected to each other by a conductor (not shown) provided on the inner wall of the through hole 13 .
[0025] The semiconductor package 20 mounted on the printed wiring board 10 is electrically connected to the various electronic components described above through the wiring 12 . The semiconductor package 20 is a BGA (Ball Grid Array: Ball Grid Array) including a pluralit...
no. 2 approach
[0057] In the first embodiment described above, the side surfaces 141 a and 142 a of the electrical connection portion 14 are exposed from the opening 15 a of the resist layer 15 . Therefore, in addition to the opposing surfaces 141b and 142b of the electrical connection portion 14, solder is also connected to the side surfaces 141a and 142a. In contrast, as Figure 8 As shown, in the electrical connection portion 140 according to the embodiment, only the facing surface 140 b is exposed from the opening 15 a, and the side surface of the electrical connection portion 140 is not exposed. Therefore, only the opposing surface 140b is connected to the solder.
[0058] However, the electrical connection part 140 and the Image 6 The illustrated electrical connection portion 14 is the same, having a central portion 141 located in the center of the contact surface with the solder ball 21 , and a pair of extending protrusions 142 extending from the central portion 141 to both sides. ...
no. 3 approach
[0061] In the above-mentioned first embodiment, the area where the electrical connection portion 14 is provided in the printed wiring board 10 is divided into four areas, and the extending direction La of the pair of extending protrusions 142 is set to the same direction for each area. In contrast, in this embodiment, if Figure 9 As shown, it is divided into 9 regions. Specifically, it is divided into an area near the center of the area where the electrical connection portion 14 is provided, an area near the corner c, and an intermediate area sandwiched between the adjacent area near the corner c and the area near the center.
[0062] Furthermore, the extending direction of the pair of extending protrusions 142 is set to be the same direction for each region. Specifically, the extension direction La of the area near the corner c is related to Figure 4 Similarly, it is set as a direction perpendicular to the direction Lb connecting the corner c and the center o in the regio...
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