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Method for cladding surface of micro-nano-copper ball with thick tin layer with weldable thickness

A weldability, micro-nano technology, applied in coatings and other directions, can solve the problems of high weld porosity and low connection strength, and achieve the effects of simple processing technology, low cost and simple material conditions

Active Publication Date: 2016-02-03
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, at present, the performance of CuSn core-shell metal powder is well reflected in the process of pressing into pre-chips, but when the metal powder is prepared into solder paste, the porosity of the weld seam obtained after welding with paste is significantly higher, and the connection strength Relatively low, the popularization and application of this kind of core-shell structure metal powder and solder paste needs to be broken through in subsequent research.

Method used

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  • Method for cladding surface of micro-nano-copper ball with thick tin layer with weldable thickness
  • Method for cladding surface of micro-nano-copper ball with thick tin layer with weldable thickness
  • Method for cladding surface of micro-nano-copper ball with thick tin layer with weldable thickness

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Implementation example 1, refer to figure 1 , 2 and 3:

[0058] Based on the above considerations, through a large number of experimental attempts and data analysis, we invented the plating method for plating the surface of micro-nano copper balls with a solderable thick tin layer. The purpose of plating a thick tin layer on the surface of the copper ball.

[0059]The method specifically includes the following steps (using 50ml of plating solution to tinplate 4g of copper powder with a particle size of 30 μm and finally making it into a high-temperature-resistant solder joint as an example):

[0060] (1), weigh 3.7g of sodium hypophosphite, 5g of thiourea, 0.02g of hydroquinone, 0.04g of ethylenediaminetetraacetic acid, dissolve in 50ml of deionized water and apply stirring at a stirring rate of 100rpm, add methanesulfonic acid 0.4g, 0.7ml of ethylene glycol, put the solution in a water bath and heat to 80°C until the solute is completely dissolved to obtain solution...

Embodiment 2

[0071] Implementation example 2, refer to figure 1 , 2 and 3:

[0072] In order to verify that this formula has an excellent coating effect on thick tin layers with solderability for copper powders of various particle sizes, we specially selected copper powders with a particle size of 1 μm for tin plating, and finally tinned the copper powder with a particle size of 1 The micron CuSn core-shell copper powder is prepared into a pre-chip for actual welding to obtain solder joints that can withstand high temperature service.

[0073] The method specifically includes the following steps (using 100ml of plating solution to tinplate 8g of copper powder with a particle size of 1 μm and finally making it into a high-temperature-resistant solder joint as an example):

[0074] (1), Weigh 7.4g of sodium hypophosphite, 10g of thiourea, 0.04g of hydroquinone, 0.08g of ethylenediaminetetraacetic acid, dissolve in 100ml of deionized water and apply stirring at a stirring rate of 100rpm, ad...

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Abstract

The invention provides a method for a cladding surface of a micro-nano-copper ball with thick tin layer with weldable thickness. According to the method, bimetallic powder clad with the thick tin layer based on a Cu@Sn core-shell structure is obtained. A presetting piece formed by pressing a bimetallic powder material is used for welding, so that low-temperature (250DEG C) welding can be realized. The obtained welding spot can be served at high temperature (676DEG C), and the reliability of the welding spot and the stability of weld joints are greatly improved. The method can be widely applied to various high temperature welding fields.

Description

technical field [0001] The invention belongs to the interdisciplinary technical field of material chemistry and material processing, and relates to a plating method for plating a thick tin layer with a solderable thickness on the surface of micro-nano copper balls. Background technique [0002] High temperature power devices are attracting increasing attention due to their great potential in automotive, downhole oil and gas industry, aircraft, space exploration, nuclear reaction environment, and radar. At present, the IGBT chips on the market generally use silicon as the raw material. However, due to the low parameters such as the bandgap width of the silicon material, the critical breakdown electric field strength, and the electron saturation rate, the development of this material is currently approaching the bottleneck. Silicon carbide (SiC) has better physical properties than silicon materials, and power devices made of SiC have the characteristics of small off-tail curre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/02
Inventor 陈宏涛胡天麒李明雨
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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