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Sequential loading and die-forging forming method for metal-matrix electronic packaged thin-walled parts

A technology for electronic packaging and thin-walled parts, which is applied in the field of sequential loading die forging for metal-based electronic packaging and thin-walled parts. Improvement, reduction of pore content, effect of less pore content

Active Publication Date: 2015-11-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The purpose of the present invention is to provide a method for sequentially loading die-forging forming of thin-walled metal-based electronic packaging parts, so as to solve the existing method of producing thin-walled parts using metal-based composite materials with high reinforcement phase content. The steps are cumbersome and the machining is difficult , It is impossible to achieve near-net shape, and at the same time, the existing method leads to high scrap rate and high machining cost

Method used

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  • Sequential loading and die-forging forming method for metal-matrix electronic packaged thin-walled parts
  • Sequential loading and die-forging forming method for metal-matrix electronic packaged thin-walled parts
  • Sequential loading and die-forging forming method for metal-matrix electronic packaged thin-walled parts

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specific Embodiment approach 1

[0033] Specific implementation mode one: combine figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 and Image 6 To illustrate this embodiment, the method described in this embodiment includes the following steps:

[0034] Step 1: first prepare a metal matrix composite material blank 1 with a reinforcing phase content;

[0035] Step 2: Next, place the metal matrix composite material blank 1 prepared in step 1 in the mold cavity 2 of the special mold, so that the metal matrix composite material blank 1 is placed on a plurality of mold cores 3 in the mold cavity 2, and the The metal matrix composite material blank 1 is heated, and the temperature of the metal matrix composite material blank 1 is controlled between 450°C and 650°C, and the metal matrix composite material blank 1 is softened in the mold cavity 2 where it is located;

[0036] Step 3: Place the combined upper mold 4 in the special mold again in the mold cavity 2 and set the gap with the metal matrix compo...

specific Embodiment approach 2

[0042] Specific implementation mode two: combination Figure 4 This embodiment will be described. In this embodiment, the pressure F is simultaneously applied to a plurality of main pressure blocks 4-1. 1 , to ensure that F 1 The pressure value reaches 400~450MPa. F obtained through multiple experiments 1 the best value of . Other structures and connections are the same as those in the first embodiment.

specific Embodiment approach 3

[0043] Specific implementation mode three: combination Figure 5 Describe this embodiment, in step 4 in this embodiment, apply pressure F to multiple main briquetting blocks 4-1 at the same time 2 , guarantee F 2 The pressure value reaches 400~500MPa. The optimal value of F2 is obtained through multiple experiments. Other structures and connections are the same as those in the first or second embodiment.

[0044] The following embodiments are described in conjunction with the accompanying drawings and the effective effects of the present invention:

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Abstract

The invention relates to a loading and die-forging forming method, in particular to a sequential loading and die-forging forming method for metal-matrix electronic packaged thin-walled parts. An existing method for producing thin-walled parts through metal-matrix composite materials with hyper-enhanced phase content is complex in step, difficult in machining and incapable of achieving near-net forming, and meanwhile the problems of high rejection rate and high machining cost are caused by the existing method. The sequential loading and die-forging forming method includes the steps that 1, a metal-matrix composite material blank with hyper-enhanced phase content is prepared; 2, the metal-matrix composite material blank is heated till being softened; 3, the metal-matrix composite material blank is pressed by multiple main pressing blocks so as to deform and form multiple upper protrusions and lower protrusions; 4, the metal-matrix composite material blank is pressed again so as to form an electronic packaged part; and 5, pressure is relieved and the electronic packaged part is taken out. The sequential loading and die-forging forming method is used for manufacturing the metal-matrix electronic packaged thin-walled parts.

Description

technical field [0001] The invention relates to a sequential loading die forging forming method for thin-wall parts of metal-based electronic packaging. Background technique [0002] In recent years, the preparation of metal matrix composites with high reinforcement phase content has attracted the attention of material workers worldwide. Compared with traditional metals and alloys, metal matrix composites with high reinforcement phase content have high specific strength, specific elastic modulus, low expansion, high thermal conductivity, the price of raw materials is less than l / 10 of tungsten copper alloy, and the weight is also It is less than 1 / 5, and the performance can be tailored arbitrarily and a series of advantages. For example, it can have high elastic modulus (over 20OGPa, equivalent to steel), ultra-high specific modulus (close to 3 times that of aluminum alloy and titanium alloy), high thermal conductivity, and extremely low thermal expansion coefficient ( com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21J5/02B21J13/02B21J1/00B21J1/06
Inventor 程远胜马卓识
Owner HARBIN INST OF TECH