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Flexible display and thin film packaging method thereof

A flexible display and thin-film packaging technology, which is applied in the manufacturing of electric solid-state devices, semiconductor devices, and semiconductor/solid-state devices, etc., can solve the problems of difficult product quality control, complex thin-film packaging processes, and difficult peeling of polymer films and carrier substrates. Achieve good adhesion and simplify the effect of thin film packaging process

Active Publication Date: 2015-11-25
TCL CORPORATION
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a flexible display and a film packaging method thereof, aiming to solve the problem that the existing flexible display film packaging process is complicated, product quality is difficult to control, and adhesives, polymers must be used. Difficult to peel off film and carrier substrate

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  • Flexible display and thin film packaging method thereof
  • Flexible display and thin film packaging method thereof
  • Flexible display and thin film packaging method thereof

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Embodiment Construction

[0047] The present invention provides a flexible display and a film encapsulation method thereof. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0048] see figure 1 , figure 1 The flow chart of a preferred embodiment of the thin film packaging method for flexible displays provided by the present invention, as shown in the figure, the thin film packaging method includes steps:

[0049] S100, performing surface treatment on the intermediate regions of the first carrier substrate and the second carrier substrate, so that the intermediate regions of the first carrier substrate and the second carrier substrate are hydrophobic;

[0050] S200, uniformly coating a polymer solution on the surface of the first ...

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Abstract

The invention discloses a flexible display and a thin film packaging method thereof. The thin film packaging method comprises steps: after surface processing is carried out on a middle region between a first carrier substrate and a second carrier substrate, a polymer solution is applied uniformly, and a corresponding first polymer thin film and a second polymer thin film are formed through heating, crosslinking and curing; on the first polymer thin film, a first blocking layer and an OLED device layer are sequentially formed; a second blocking layer is formed on the second polymer thin film, the second polymer thin film and the second blocking layer are separated from the second carrier substrate to serve as a polymer packaging film; curing processing is carried out around the polymer packaging film, and thus the second polymer thin film and the first polymer thin film are crosslinked and cured around to form polymer gel; and the polymer gel is cut, and the flexible display is separated from the first carrier substrate. The thin film packaging technology is simplified, the display device can be separated from the carrier substrate easily, and a bonding agent does not need to be used.

Description

technical field [0001] The invention relates to the field of flexible displays, in particular to a flexible display and a film packaging method thereof. Background technique [0002] In recent years, flexible displays have become a research hotspot in universities and research institutions at home and abroad, and are also the focus of major manufacturers competing for layout. Various manufacturing processes and technologies have been continuously improved, which has not only increased the screen size of flexible displays, but also continuously improved the display quality. Major manufacturers such as Samsung and LG have launched flexible AMOLED (active matrix organic light-emitting diode panel) display prototypes. Flexible displays use flexible substrate materials as device-carrying substrates, and require electrode layers, TFT matrix, display devices, and packaging layers to have a certain bending radius to achieve flexibility. [0003] Compared with ordinary displays, fle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L21/50H01L27/32
Inventor 高卓申智渊
Owner TCL CORPORATION
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