Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

118 results about "Polymer encapsulation" patented technology

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

A process for packaging semiconductor devices for flip chip and wire bond applications, wherein specific materials of the semiconductor devices are protected during device processing sequences and dicing procedures, has been developed. After definition of copper interconnect structures surrounded by a low k insulator layer, a protective, first photosensitive polymer layer comprised with a low dielectric constant is applied. After definition of openings in the first photosensitive polymer layer exposing portions of the top surface of the copper interconnect structures, a dicing lane opening is defined in materials located between copper interconnect structures. Conductive redistribution shapes are formed on the copper interconnect structures exposed in the openings in the first photosensitive polymer layer, followed by application of a protective, second photosensitive polymer layer. An opening is defined in the second photosensitive polymer layer exposing a portion of the top surface of a redistribution shape followed by placement of a solder ball in this opening. A reflow anneal procedure results in the solder ball wetting and overlying only the portion of the redistribution shape exposed in the opening in the second photosensitive polymer layer. Separation of the solder ball, flip chip regions from the non-solder ball, wire bond regions is accomplished via a dicing procedure performed in the dicing lane.
Owner:AGENCY FOR SCI TECH & RES

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

A process for packaging semiconductor devices for flip chip and wire bond applications, wherein specific materials of the semiconductor devices are protected during device processing sequences and dicing procedures, has been developed. After definition of copper interconnect structures surrounded by a low k insulator layer, a protective, first photosensitive polymer layer comprised with a low dielectric constant is applied. After definition of openings in the first photosensitive polymer layer exposing portions of the top surface of the copper interconnect structures, a dicing lane opening is defined in materials located between copper interconnect structures. Conductive redistribution shapes are formed on the copper interconnect structures exposed in the openings in the first photosensitive polymer layer, followed by application of a protective, second photosensitive polymer layer. An opening is defined in the second photosensitive polymer layer exposing a portion of the top surface of a redistribution shape followed by placement of a solder ball in this opening. A reflow anneal procedure results in the solder ball wetting and overlying only the portion of the redistribution shape exposed in the opening in the second photosensitive polymer layer. Separation of the solder ball, flip chip regions from the non-solder ball, wire bond regions is accomplished via a dicing procedure performed in the dicing lane.
Owner:AGENCY FOR SCI TECH & RES

Passive optical fiber grating submarine sound signal sensor and making method thereof

The present invention relates to a passive optical fiber grating underwater acoustic signal sensor and a manufacture method. Two cavity bodies being distributed by the central symmetrical way is arranged inside a polymer encapsulation body, the both ends of the cavity body are sealed, and an optical fiber grating is threaded through and fixed at the axle line position of the polymer encapsulation body. The polymer encapsulation body is a columnar body, the cross section of the cavity body can be circular, elliptic, quadrate or D-shaped. The manufacturing method is that firstly, a die is made according to the structure of the polymer encapsulation body, an optical fiber grating is fixed into the die, and then a polymer is heated to be the molten state and slowly poured into the die, finally the optical fiber grating polymer encapsulation body is arranged into a warm box to be solidified and aged. The present invention is characterized in that the sensitivity of the acoustic pressure is high, the passive optical fiber grating underwater acoustic signal sensor is three to four magnitude orders higher than the underwater acoustic sensor directly made of optical fiber grating, the characteristics of light mass, small structure, and high sensitivity are fully realized, thus the present invention has important application prospect in the underwater acoustic detection field.
Owner:李智忠
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products