Shielding and grounding foam tape with metal foil as base material and preparing method thereof

A metal foil and substrate technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., to achieve good die-cutting, excellent electromagnetic shielding function, and excellent three-dimensional electromagnetic shielding function Effect

Active Publication Date: 2015-12-02
SHENZHEN MEIXIN ELECTRONICS
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the technical problems of the existing conductive foam tape, the present invention provid

Method used

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  • Shielding and grounding foam tape with metal foil as base material and preparing method thereof

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Embodiment Construction

[0025] Below in conjunction with example the present invention is described in further detail.

[0026] like figure 1 As shown, the embodiments of the present invention provide a shielding and grounding system based on metal foil

[0027] Conductive foam tape, which includes shielding and grounding conductive foam 1, hot melt adhesive 2, metal foil substrate 3, conductive adhesive layer 4, and release material layer 5, which are stacked sequentially from top to bottom.

[0028] In this embodiment, the metal foil substrate 3 can be selected from one of rolled copper foil, electrolytic copper foil, aluminum foil or aluminum foil / copper foil composite material with vertical conduction performance with different thicknesses having excellent electromagnetic shielding effect. The shielding and grounding conductive foam 1 has a thickness ranging from 0.2mm to 5.0mm, and the surface of the shielding and grounding conductive foam is vacuum-plated with metal materials. Compared with t...

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Abstract

The invention discloses a shielding and grounding conductive foam tape with a metal foil sheet as the base material. The tape comprises shielding and grounding conductive foam, a hot melting adhesive layer, the metal foil sheet base material, a conductive adhesive layer and a release material layer which are sequentially stacked from top to bottom. The invention further discloses a method for preparing the shielding and grounding conductive foam tape. Compared with products in the current market with conducive cloth or gauze as the base material, the shielding and grounding conductive foam tape with the metal foil sheet as the base material has the advantages that conductivity is high, electromagnetic shielding function is better, die cutting can be achieved more easily, and the phenomenon which can happen on the conductive cloth that broken filaments appear is avoided. Compared with the method according to which ordinary conductive pressure-sensitive adhesive is adopted for gluing foam to a base material, the shielding and grounding conductive foam tape with the metal foil sheet as the base material has the advantage that the rebound resilience of foam is higher, and the problem that the rebound resilience of the foam is poor due to the fact that the foam is stuck with glue during die cutting or using is solved.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to an all-round conductive foam adhesive tape with metal foil as a base material and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the physical size of integrated circuits has been gradually reduced. The continuous improvement of integration and the widespread use of more conductive materials make electrostatic discharge and electromagnetic shielding increasingly important, so that the problems of electrostatic protection and electromagnetic shielding are also receiving more and more attention. Conductive foam tape is a composite of foam base and conductive material for EMI shielding with large fill gaps or tolerances. The foam's elasticity and consistency make it ideal for applications requiring low closure force and minimal compression set. Conductive foam tape can play the role of shock absorption, electromagnetic shielding, ...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J9/02C09J133/00C09J11/04
Inventor 陆兰硕洪文洲林学好
Owner SHENZHEN MEIXIN ELECTRONICS
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