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Highly-stable electroless copper plating process of PCB (Printed circuit board)

An electroless copper plating and high stability technology, applied in the field of PCB board manufacturing process, can solve the problems of prolonging the reaction temperature and the deposition thickness, and it is difficult to meet the thickness requirements, so as to achieve the effect of fast deposition rate and stable plating solution.

Inactive Publication Date: 2015-12-02
永利电子铜陵有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary electroless thin copper plating process, even if the reaction temperature is appropriately increased and the reaction time is prolonged, the deposition thickness is sometimes difficult to meet the thickness requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] A PCB high stability electroless copper plating process, comprising the following steps:

[0016] (1) Whole hole: Put the drilled circuit board into 5% alkaline degreaser, treat it at 50°C for 5 minutes, take it out and clean it with hot water;

[0017] (2) Micro-etching: Put the circuit board after the whole hole into the mixed solution of 80g / L sodium persulfate and 3% sulfuric acid at room temperature, take it out after 2 minutes of treatment, and wash it twice with water;

[0018] (3) Pre-soaking: Put the micro-etched circuit board into a mixed solution of 25g / L stannous sulfate, 50ml / L hydrochloric acid, and 3g / L fluoride for 1 minute at room temperature;

[0019] (4) Activation: Put the pre-soaked circuit board into the colloidal palladium solution containing 40×10-6Pd, treat it at 40°C for 5 minutes, take it out and wash it twice with water;

[0020] (5) Acceleration: put the activated circuit board into 10% acceleration solution, treat it at room temperature fo...

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PUM

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Abstract

The invention discloses a highly-stable electroless copper plating process of a PCB (Printed circuit board), and relates to the technical field of manufacturing of PCBs. The process mainly comprises the steps: processing a hole; microetching; pre-soaking; activating; accelerating; performing electroless copper plating. According to the process, a plating solution is stable; the deposition rate is high; all performances of a plating layer can meet the industrial production of the PCB.

Description

technical field [0001] The invention relates to a PCB manufacturing process, more specifically a PCB high-stable chemical copper plating process. Background technique [0002] Electroless copper plating refers to a surface treatment technology in which copper ions and reducing agents in the same solution perform a self-catalyzed oxidation-reduction reaction on the surface of a catalytically active substrate to deposit a copper coating under the condition of no external current. At present, one of the most important application fields of electroless copper plating in industry is the through-hole metallization process of printed circuit boards. A layer of copper is deposited in the insulating hole wall of the printed circuit board to make the through-hole metallization, so that Then electroplating to thicken the plating layer conducts the interlayer circuit. Even if the ordinary electroless thin copper plating process increases the reaction temperature and prolongs the reacti...

Claims

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Application Information

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IPC IPC(8): C23C18/38
Inventor 柏万春严正平柏寒
Owner 永利电子铜陵有限公司
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