Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method of preparing various single-side multilayer single-functional and single-side and double-side multilayer multifunctional printed electronic product by virtue of light induction

An electronic product, light-induced technology, applied in the direction of electric recording technology, printed circuit, conductive pattern formation, etc., which can solve the problems of high efficiency, high resolution, and large-scale electronic circuit production, and achieve green Environmentally friendly and efficient production, no waste liquid, and small investment in equipment

Inactive Publication Date: 2015-12-02
HARBIN INST OF TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the existing inkjet printed electronic technology cannot realize high-efficiency, high-resolution, and large-scale electronic circuit production, the present invention proposes the preparation of multiple single-sided multi-layer single-function and single-sided, Method for printing electronic products with double-sided multi-layer and multi-function

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of preparing various single-side multilayer single-functional and single-side and double-side multilayer multifunctional printed electronic product by virtue of light induction

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0039] Specific implementation mode 1, refer to figure 1 Specifically explain this embodiment, the method for preparing a single-sided multi-layer single-function printed electronic product using light induction described in this embodiment, it includes the following steps:

[0040] Step 11, selecting a non-conductive material as the substrate;

[0041] Step 21, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

[0042] Step 31, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

[0043]Step 41, coating the Nth functional toner with charge on the photosensitive materi...

specific Embodiment approach 2

[0054] Embodiment 2. Based on Embodiment 1, the method for preparing a double-sided multilayer single-function printed electronic product includes the following steps:

[0055] Step 1-1, selecting a non-conductive material as the substrate;

[0056] Step 2-1, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

[0057] Step 3-1, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

[0058] Step 4-1, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functiona...

specific Embodiment approach 3

[0068] Specific Embodiment Three. The method for preparing a single-sided multi-layer single-function printed electronic product using light induction described in this embodiment includes the following steps:

[0069] Step A, selecting a non-conductive material as the substrate;

[0070] Step B, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

[0071] Step C, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

[0072] Step D, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method of preparing various single-side multilayer single-functional and a single-side and double-side multilayer multifunctional printed electronic product by virtue of light induction, and relates to the technical field of printed electronics, and solves the problem that an existing inkjet printing electronic technology cannot realize the high-efficiency mass production of high-resolution electronic circuits. The method comprises the following steps: first selecting a substrate, then completing the design of circuit information or insulation layer information on a computer, controlling the radiation of optical beams by virtue of an optical beam controller, enabling the circuit information or insulation layer information to be stored in a photosensitive material, forming an electrostatic latent image of the circuit or insulation layer information, covering the photosensitive material with functional ink powder, converting the circuit information or insulation layer information into a visible ink powder circuit or insulation layer image, transfer printing the functional ink powder onto the substrate by virtue of hot-pressing sintering or electrostatic adsorption or the combination of the hot-pressing sintering and electrostatic adsorption, and roasting the substrate to form a circuit layer or an insulation layer. The method is also suitable for printing an integrated circuit.

Description

technical field [0001] The invention relates to the technical field of printed electronics; in particular, it relates to a printed electronic technology using light-induced conductive toner to form circuits. Background technique [0002] In the electronic information manufacturing industry, the traditional copper foil etching technology is widely used because of its mature technology, but it also brings environmental pollution due to its complicated manufacturing process, numerous production processes, large material consumption, and large amount of waste liquid. It was widely criticized because of the great pressure. In order to overcome the cumbersome process and serious pollution of traditional copper foil etching technology, and meet the development requirements of a new generation of flexible circuits and wearable circuits, inkjet printed electronics technology emerged as the times require. [0003] The basic idea of ​​inkjet printed electronic technology is to print e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03G15/00H05K3/10
CPCG03G15/6591H05K3/106
Inventor 林铁松何鹏刘贵铭
Owner HARBIN INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com