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Composite wood adhesive and preparation method thereof

A wood glue and mixture technology, applied in the field of wood adhesives, can solve the problems of poor water resistance, low bonding strength, and high brittleness of cured glue, and achieve the effects of strong water resistance, high bonding strength and small brittleness

Inactive Publication Date: 2015-12-09
陈薇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silicon-based inorganic adhesives represented by water glass are prone to defects such as high brittleness, low bonding strength, and poor water resistance when bonding wood materials, which seriously affect their application.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] In the embodiment of the present invention, a composite wood glue is composed of the following raw materials in parts by weight: 70 parts of water glass, 5 parts of dodecylbenzenesulfonic acid, 30 parts of polyphenyl polymethylene polyisocyanate, ethylene glycol 8 parts of amine tetraacetic acid, 5 parts of sodium metachlorate, 20 parts of deionized water.

[0018] The preparation method of composite wood glue is made up of the following steps:

[0019] 1) Add half of the deionized water to the water glass, then seal it, stir and heat it to 50°C, after it is completely dissolved, add dodecylbenzenesulfonic acid, seal and stir at 50°C for 0.5h, then cool down to room temperature Mixture A is obtained;

[0020] 2) Put the remaining half of the deionized water into ethylenediaminetetraacetic acid, seal and heat to 100°C, and keep warm at this temperature for 0.2h, then add polyphenylpolymethylene polyisocyanate, seal and stir for 1h, drop Mixture B is obtained at room te...

Embodiment 2

[0023] In the embodiment of the present invention, a composite wood glue is composed of the following raw materials in parts by weight: 90 parts of water glass, 15 parts of dodecylbenzenesulfonic acid, 45 parts of polyphenyl polymethylene polyisocyanate, ethylene glycol 14 parts of amine tetraacetic acid, 12 parts of sodium metachlorate, 40 parts of deionized water.

[0024] The preparation method of composite wood glue is made up of the following steps:

[0025] 1) Add half of the deionized water to the water glass, then seal it, stir and heat it to 60°C, after it is completely dissolved, add dodecylbenzenesulfonic acid, seal and stir at 60°C for 1 hour, cool down to room temperature Obtain mixture A;

[0026] 2) Put the remaining half of the deionized water into ethylenediaminetetraacetic acid, seal and heat to 130°C, and keep warm at this temperature for 0.5h, then add polyphenylpolymethylene polyisocyanate, seal and stir for 2h, drop Mixture B is obtained at room tempera...

Embodiment 3

[0029] In the embodiment of the present invention, a composite wood glue is composed of the following raw materials in parts by weight: 75 parts of water glass, 8 parts of dodecylbenzenesulfonic acid, 35 parts of polyphenyl polymethylene polyisocyanate, ethylene glycol 10 parts of amine tetraacetic acid, 8 parts of sodium metachlorate, and 25 parts of deionized water.

[0030] The preparation method of composite wood glue is made up of the following steps:

[0031] 1) Add half of the deionized water to the water glass, then seal it, stir and heat it to 52°C, after it is completely dissolved, add dodecylbenzenesulfonic acid, seal and stir at 52°C for 0.6h, and cool down to room temperature Mixture A is obtained;

[0032] 2) Put the remaining half of the deionized water into ethylenediaminetetraacetic acid, seal and heat to 107°C, and keep warm at this temperature for 0.3h, then add polyphenylpolymethylene polyisocyanate, seal and stir for 1.2h, Reduce to room temperature and ...

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Abstract

The invention discloses a composite wood adhesive and a preparation method thereof. The composite wood adhesive is prepared from the following raw materials in parts by weight: 70 to 90 parts of water glass, 5 to 15 parts of dodecylbenzene sulfonic acid, 30 to 45 parts of polyphenylpolymethylene isocyanate, 8 to 14 parts of edetic acid, 5 to 12 parts of sodium chlorate and 20 to 40 parts of deionized water. The preparation method comprises the following steps: during preparation, adding the deionized water into the water glass, sealing and heating, adding the dodecylbenzene sulfonic acid, and sealing and stirring to prepare a mixture A; adding the deionized water into the edetic acid, sealing and heating, then adding the polyphenylpolymethylene isocyanate, sealing and stirring, and cooling to the room temperature to prepare a mixture B; then performing ultrasonic treatment, placing into the mixture A, mixing and stirring, adding the sodium chlorate after heating, stirring, and cooling to the room temperature to obtain the composite wood adhesive. The cure adhesive provided by the invention is small in brittleness, high in bonding strength, strong in water tolerance, corrosion-resistant, ageing resistant, simple in manufacturing process, and suitable for industrial production.

Description

technical field [0001] The invention relates to a wood adhesive, in particular to a composite wood glue and a preparation method thereof. Background technique [0002] The wood-based panel industry requires extensive use of adhesives. However, with the development and progress of science and technology, and people's increasing awareness of environmental protection, modern society has higher and higher requirements for adhesives for wood-based panels, which are mainly reflected in high performance and environmental protection. The development of pollution-free, non-toxic Toxic high-performance adhesives have become an inevitable trend in the development of wood adhesives. [0003] As far as the existing technology is concerned, silicon-based inorganic adhesives represented by water glass are an important adhesive variety with a wide range of sources, low prices, and environmental friendliness. Strong, good temperature resistance, corrosion resistance, fire resistance, acid ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/04C09J11/06
Inventor 陈薇
Owner 陈薇
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