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Modified phenolic resin adhesive for chemical resistant laminate

A technology of phenolic resin glue and phenolic resin, which is applied in the field of physical and chemical boards, can solve the problems of poor heat resistance and oxidation resistance, warping and deformation of physical and chemical boards, and glue opening by drum guns, so as to improve the demoulding effect and reduce the cost of products , The effect of easy demoulding

Inactive Publication Date: 2015-04-29
ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Phenolic resin has developed rapidly due to its unique performance and wide application. In the preparation process of physical and chemical boards, phenolic resin is often used as an adhesive to produce weather-resistant physical and chemical boards. It has the advantages of uniform stress, high bonding strength, and good water resistance. , due to the tight stacking of rigid aromatic rings connected by methylene in the molecular structure of phenolic resin, the phenolic resin body becomes brittle, and the phenolic hydroxyl and methylene groups on the phenolic resin are easily oxidized, and the heat resistance and oxidation resistance are not good. It is easy to cause warping and deformation of large-scale multi-layer physical and chemical boards or the occurrence of glue-opening defects. How to prepare a physical and chemical board adhesive with low cost, good mechanical properties and heat resistance, excellent bonding performance, and good toughness has become the current technical issues to be resolved

Method used

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  • Modified phenolic resin adhesive for chemical resistant laminate
  • Modified phenolic resin adhesive for chemical resistant laminate
  • Modified phenolic resin adhesive for chemical resistant laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of modified phenolic resin adhesive for physical and chemical board proposed by the present invention, its raw material comprises by weight:

[0022]

[0023]

[0024] In the preparation process of the modified phenolic resin, the cashew nut oil is sent to the distiller for vacuum distillation. The vacuum distillation temperature is 220°C, the vacuum distillation pressure is 1000Pa, and the preformed phenolic resin with a viscosity of 64mPa·s (25°C) is obtained. Material; Weigh 100 parts of phenol, 20 parts of prefabricated material, 20 parts of formaldehyde, 1 part of catalyst and 1.5 parts of additives in the reaction bottle by weight, add hydrochloric acid solution to adjust the pH value to 1.4, at a speed of 3 °C / min Raise the temperature to 100°C, keep it warm for 1.5h, and dehydrate under reduced pressure to obtain a modified phenolic resin.

Embodiment 2

[0026] A kind of modified phenolic resin adhesive for physical and chemical board proposed by the present invention, its raw material comprises by weight:

[0027]

[0028] In the preparation process of the modified phenolic resin, the cashew nut oil is sent to a distiller for vacuum distillation. The vacuum distillation temperature is 220°C, and the vacuum distillation pressure is 1200Pa to obtain a preformed phenolic resin with a viscosity of 60mPa·s (25°C). Material; Weigh 100 parts of phenol, 40 parts of prefabricated material, 15 parts of formaldehyde, 2 parts of catalyst and 1 part of auxiliary agent into the reaction bottle by weight, add hydrochloric acid solution to adjust the pH value to 1.8, at a speed of 1 °C / min Raise the temperature to 100°C, keep it warm for 2 hours, and dehydrate under reduced pressure to obtain a modified phenolic resin.

Embodiment 3

[0030] A kind of modified phenolic resin adhesive for physical and chemical board proposed by the present invention, its raw material comprises by weight:

[0031]

[0032] In the preparation process of the modified phenolic resin, the cashew nut oil is sent to the distiller for vacuum distillation. The vacuum distillation temperature is 220°C, the vacuum distillation pressure is 1100Pa, and the preformed phenolic resin with a viscosity of 62mPa·s (25°C) is obtained. Material; Weigh 100 parts of phenol, 32 parts of prefabricated material, 17 parts of formaldehyde, 1.4 parts of catalyst and 1.3 parts of auxiliary agent into the reaction bottle by weight, add hydrochloric acid solution to adjust the pH value to 1.5, at a speed of 2 °C / min Raise the temperature to 100°C, keep it warm for 1.8h, and dehydrate under reduced pressure to obtain a modified phenolic resin.

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Abstract

The invention discloses a modified phenolic resin adhesive for a chemical resistant laminate. The adhesive is prepared from the following raw materials in parts by weight: 40-60 parts of modified phenolic resin, 1.5-2 parts of carboxylic butadiene-styrene latex, 1-1.5 parts of silicon resin methyl branched chain silicone oil, 0.6-0.9 part of surfactant, 0.5-1 part of dipentaerythritol, 1.5-2 parts of polyborosiloxane, 1-2.5 parts of nano-magnesium oxide, 10-15 parts of poplar bark powder, 4-8 parts of natural sodium bentonite and 2-6 parts of anti-aging agent TCY. The modified phenolic resin adhesive has the advantages of low cost, good mechanical performance, good heat resistance, excellent adhering performance and good toughness.

Description

technical field [0001] The invention relates to the technical field of physical and chemical boards, in particular to a modified phenolic resin adhesive for physical and chemical boards. Background technique [0002] Phenolic resin has developed rapidly due to its unique performance and wide application. In the preparation process of physical and chemical boards, phenolic resin is often used as an adhesive to produce weather-resistant physical and chemical boards. It has the advantages of uniform stress, high bonding strength, and good water resistance. , due to the tight stacking of rigid aromatic rings connected by methylene in the molecular structure of phenolic resin, the phenolic resin body becomes brittle, and the phenolic hydroxyl and methylene groups on the phenolic resin are easily oxidized, and the heat resistance and oxidation resistance are not good. It is easy to cause warping and deformation of large-scale multi-layer physical and chemical boards or the occurre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/14C09J113/02C09J11/08C09J11/06C09J11/04C08G8/28
Inventor 徐学武
Owner ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL IND
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