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Method for producing patch aluminum electrolytic capacitor

A technology of aluminum electrolytic capacitors and production methods, applied in capacitors, capacitor manufacturing, circuits, etc., can solve the problems of unreliable welding of lead-out parts, falling aluminum electrolytic capacitors, poor ventilation, etc.

Inactive Publication Date: 2015-12-09
HUNAN AIHUA GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the gap between the soldering surface of the base and the printed circuit board is not large, the ventilation is not smooth during the reflow soldering process, resulting in poor heating between the lead wires of the aluminum electrolytic capacitor and the solder, and incomplete contact between the lead wires and the solder during soldering. As a result, the solder adhesion on the surface of the lead-out line is not enough
When encountering severe vibration or abnormal external force, the aluminum electrolytic capacitor will easily fall off the printed circuit board due to the unreliable soldering of the lead wire, and the defect rate is 5% to 10%.

Method used

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  • Method for producing patch aluminum electrolytic capacitor
  • Method for producing patch aluminum electrolytic capacitor
  • Method for producing patch aluminum electrolytic capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Depend on figure 1 , figure 2 It can be seen that a production method of a chip aluminum electrolytic capacitor comprises the following steps:

[0028] ⑴Preparation of core bag;

[0029] ⑵ Formation;

[0030] (3) Flatten the lead pin: for the convenience of assembling the base, flatten the root of the lead wire at one end of the capacitor;

[0031] (4) Aging;

[0032] (5) Assembly: Insert the lead wire of the aluminum electrolytic capacitor into the lead wire through hole 2 on the base and bend the lead wire in the lead wire groove 6. The welding surface of the base is provided with a support boss 3 and a width covering The lead-out line passes through the hole 2, and the length runs through the ventilation slot 4 on the edge of the base. The center line of the ventilation slot 4 is perpendicular to the center line of the lead wire groove 6.

[0033] In order to ensure unobstructed hot air and sufficient heating of the lead wire and solder, the lead wire groove 6 ...

Embodiment 2

[0043] This embodiment further illustrates the present invention by taking the preparation of a chip aluminum electrolytic capacitor with a specification of 400V1μF as an example.

[0044] Depend on image 3 , Figure 4 , Figure 5 , Figure 6 It can be seen that, in order to prevent the short circuit between the two lead wires of the aluminum electrolytic capacitor in the reflow soldering process and ensure the normal use of the printed circuit board, the present invention is provided with a separation bump between the two lead wire through holes 2 on the soldering surface 5.

[0045] The length of the separation bump 5 in the present invention is 0.8 to 2.5 times the width of the lead groove 6, and the width of the separation bump 5 is 1 / 3 to 1 / 5 of the center hole distance of the through holes 2 of the two lead wires. The height of the block 5 is less than or equal to the height of the support boss 3 , that is, the top surface of the separation projection 5 is lower tha...

Embodiment 3

[0052] This embodiment further illustrates the present invention by taking the preparation of a chip aluminum electrolytic capacitor with a specification of 450V and 22 μF as an example.

[0053] Depend on Figure 7 It can be seen that, in order to ensure the strength of the base, two ventilation slots 4 are provided on the welding surface of the base of the present invention, that is, each ventilation slot 4 corresponds to a lead-through hole 2, and the two ventilation slots 4 are not connected.

[0054]The basic size of the base used in this embodiment is 17㎜×17㎜, the distance between the centers of the two lead through holes 2 is 7.3㎜, and the dimensions of the two lead grooves 6 are as follows: the groove length is 5.3㎜, and the groove width is 1.4㎜ , the groove depth is 0.45mm. The size of the ventilation slot 4 is as follows: the slot length is 17 mm, the slot width is 2.98 mm, and the slot depth is 0.30 mm; the size of the lead wire expansion slot 7 is as follows: the ...

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Abstract

The invention discloses a method for producing a patch aluminum electrolytic capacitor for improving the welding effect in reflow welding process, which is characterized in that the method comprises following steps: manufacturing a core clad; setting as group; flattening a lead pin; aging; and assembling: outgoing lines of the aluminum electrolytic capacitor are inserted into outgoing line through holes on a base and the outgoing lines are bent in a lead recess; a support boss, a through hole with width covering the outgoing line and a ventilating groove with length penetrating through the base edge are set on a welding surface of the base; and a central line of the ventilating groove is vertical to a central line of the lead recess. According to the invention, the ventilating groove is set on the welding surface of the base; in the reflow welding technology, the heating effects of the outgoing lines and a welding tin are improved, thus the produced patch aluminum electrolytic capacitor has high reliability, strong ability to resist vibration and strong weldability; the defect rate is lowered less than one thousandth; and at the same time, the separation boss is provided, thus the phenomenon of short circuit between the two outgoing lines of the aluminum electrolytic capacitor is avoided and a printing circuit board is ensured to be in normal use.

Description

technical field [0001] The invention relates to a chip aluminum electrolytic capacitor, in particular to a production method of a chip aluminum electrolytic capacitor, in particular to a production method of a chip aluminum electrolytic capacitor which improves the welding effect in reflow soldering. Background technique [0002] In the production of electronic products, in order to achieve high assembly density and reduce the volume and weight of electronic products, surface mount technology (SMT) is often used. It requires electronic components to be patch components. Generally, after SMT is used, electronic products have high reliability. Strong anti-vibration ability, low solder joint defect rate, good high-frequency characteristics, reducing electromagnetic and radio frequency interference, easy to realize automation, improving production efficiency, saving materials, energy, equipment, manpower, time, etc. [0003] In the production of chip electrolytic capacitors, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G13/00H01G9/045
Inventor 艾亮杨治安陶艳军夏商王灿
Owner HUNAN AIHUA GRP