Method for producing patch aluminum electrolytic capacitor
A technology of aluminum electrolytic capacitors and production methods, applied in capacitors, capacitor manufacturing, circuits, etc., can solve the problems of unreliable welding of lead-out parts, falling aluminum electrolytic capacitors, poor ventilation, etc.
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Embodiment 1
[0027] Depend on figure 1 , figure 2 It can be seen that a production method of a chip aluminum electrolytic capacitor comprises the following steps:
[0028] ⑴Preparation of core bag;
[0029] ⑵ Formation;
[0030] (3) Flatten the lead pin: for the convenience of assembling the base, flatten the root of the lead wire at one end of the capacitor;
[0031] (4) Aging;
[0032] (5) Assembly: Insert the lead wire of the aluminum electrolytic capacitor into the lead wire through hole 2 on the base and bend the lead wire in the lead wire groove 6. The welding surface of the base is provided with a support boss 3 and a width covering The lead-out line passes through the hole 2, and the length runs through the ventilation slot 4 on the edge of the base. The center line of the ventilation slot 4 is perpendicular to the center line of the lead wire groove 6.
[0033] In order to ensure unobstructed hot air and sufficient heating of the lead wire and solder, the lead wire groove 6 ...
Embodiment 2
[0043] This embodiment further illustrates the present invention by taking the preparation of a chip aluminum electrolytic capacitor with a specification of 400V1μF as an example.
[0044] Depend on image 3 , Figure 4 , Figure 5 , Figure 6 It can be seen that, in order to prevent the short circuit between the two lead wires of the aluminum electrolytic capacitor in the reflow soldering process and ensure the normal use of the printed circuit board, the present invention is provided with a separation bump between the two lead wire through holes 2 on the soldering surface 5.
[0045] The length of the separation bump 5 in the present invention is 0.8 to 2.5 times the width of the lead groove 6, and the width of the separation bump 5 is 1 / 3 to 1 / 5 of the center hole distance of the through holes 2 of the two lead wires. The height of the block 5 is less than or equal to the height of the support boss 3 , that is, the top surface of the separation projection 5 is lower tha...
Embodiment 3
[0052] This embodiment further illustrates the present invention by taking the preparation of a chip aluminum electrolytic capacitor with a specification of 450V and 22 μF as an example.
[0053] Depend on Figure 7 It can be seen that, in order to ensure the strength of the base, two ventilation slots 4 are provided on the welding surface of the base of the present invention, that is, each ventilation slot 4 corresponds to a lead-through hole 2, and the two ventilation slots 4 are not connected.
[0054]The basic size of the base used in this embodiment is 17㎜×17㎜, the distance between the centers of the two lead through holes 2 is 7.3㎜, and the dimensions of the two lead grooves 6 are as follows: the groove length is 5.3㎜, and the groove width is 1.4㎜ , the groove depth is 0.45mm. The size of the ventilation slot 4 is as follows: the slot length is 17 mm, the slot width is 2.98 mm, and the slot depth is 0.30 mm; the size of the lead wire expansion slot 7 is as follows: the ...
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