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Two-way withstand voltage silicon carbide solid-state switch

A solid-state switch and silicon carbide technology, which is applied in semiconductor/solid-state device components, electric solid-state devices, electrical components, etc., can solve the problems of difficult processing, strong process specificity, difficulty in solid-state switch process, and reliability and realizability and other issues, to achieve the effect of large design freedom, guaranteed reliability, and strong realizability

Inactive Publication Date: 2015-12-09
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

U.S. Patents US7391057 and US7615801 disclose the structure and manufacturing method of bidirectional voltage-resistant silicon carbide devices based on low-doped high-purity semi-insulating N-type or P-type substrates, which can realize bidirectional voltage-resistant silicon carbide devices, and bidirectional voltage-resistant carbonization The silicon thyristor is used as an example to introduce this method, but it does not mention whether it solves the problem that the silicon carbide thyristor is difficult to effectively turn off when the conduction current exists, and its process requires processing of the same complexity on the front and back of the substrate , it is also necessary to form a symmetrical groove with a certain slope on the side of the silicon carbide device (usually only a few hundred um) by plasma etching or mechanical grinding / polishing. Strong, which has a great impact on the process difficulty, reliability, and realizability of solid-state switches

Method used

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  • Two-way withstand voltage silicon carbide solid-state switch
  • Two-way withstand voltage silicon carbide solid-state switch

Examples

Experimental program
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Embodiment 1

[0024] Such as figure 1 As shown, a bidirectional voltage-resistant silicon carbide solid-state switch includes a silicon carbide chip, an adapter plate 2, a positioning plate, a bonding layer and an insulating passivation layer 6, wherein: the silicon carbide chip includes a silicon carbide upper chip 11 and a silicon carbide The lower chip 12, the middle of the adapter plate 2 is embedded with several interconnected metal columns 4 that run through the adapter plate 2 longitudinally, the positioning plate includes an upper positioning plate 31 and a lower positioning plate 32, and the bonding layer includes an upper bonding layer 51 and The lower bonding layer 52; the upper positioning plate 31 is used to fix the silicon carbide upper chip 11 on the upper bonding layer 51, and the lower positioning plate 32 is used to fix the silicon carbide lower chip 12 on the lower bonding layer 52; The upper chip 11 and the upper positioning plate 31 are connected to the upper surface of...

Embodiment 2

[0033] This embodiment is based on the composition structure of embodiment 1, differs in material:

[0034] The silicon carbide-on-chip 11 is a silicon carbide P-type insulated gate bipolar transistor chip with a withstand voltage of 5000V, an on-resistance of 200-300mΩ, a chip area of ​​2mm×2mm, and a turn-off voltage of not less than -15V;

[0035] The silicon carbide lower chip 12 is a silicon carbide Schottky barrier diode chip with a withstand voltage of 5000V and a chip area of ​​2mm×2mm; the thickness of the adapter plate 2 is 150um; the upper and lower positioning plates 31 and 32 with a thickness of 150um.

[0036]The forward and reverse withstand voltages of the bidirectional silicon carbide solid-state switch of this embodiment are both 5000V, and can be turned off effectively. The gate turn-off voltage is not less than -15V, and the switch size is not more than 3mm×3mm×1.5mm.

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Abstract

The invention discloses a two-way withstand voltage silicon carbide solid-state switch. The switch comprises a silicon carbide chip, a switch plate, a positioning plate, and a bonding layer, the silicon carbide chip comprises a silicon carbide upper chip and a silicon carbide lower chip, a plurality of interconnection metal columns penetrating through the switch plate in a vertical manner are embedded in the middle of the switch plate, the positioning plate comprises an upper positioning plate and a lower positioning plate, the bonding layer comprises an upper bonding layer and a lower bonding layer, the silicon carbide upper chip and the upper positioning plate are connected with the upper surface of the switch plate via the upper bonding layer, and the silicon carbide lower chip and the lower positioning plate are connected with the lower surface of the switch plate via the lower bonding layer. According to the switch, the plurality of interconnection metal columns penetrating through the switch plate in the vertical manner are embedded in the middle of the switch plate so that electrical interconnection is realized via the interconnection metal columns, reliability and effectiveness are realized, the process is simple, effective turn-off and two-way withstand voltage of the switch are simultaneously realized, the size of the switch is equivalent to the size of the usual silicon carbide chip, common silicon carbide devices and packaging process are employed, and the machining does not have challenged difficulties.

Description

Technical field [0001] The invention involves the field of power electronics technology and power semiconductor device technology. It is specifically a two -way voltage -resistant silicon carbide solid switch. Background technique [0002] High -voltage, large current, anti -radiation, chip -based semiconductor solid switch has a lot of application space in the fields of aerospace, power electronics and power semiconductors.Traditional silicon -based solid -state switch performance has approached the limits of the material, and it is difficult to further improve.The prohibited bandwidth of the wide -band semiconductor silicon carbide material is three times the width of the silicon. The penetration field is one or more higher than that of silicon, which can greatly increase the level of resistance, large current, radiation resistance and miniaturization of solid -state switches. [0003] The existing silicon carbide solid -state switch with high voltage and large -current resista...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/48
Inventor 代刚张健李俊焘徐星亮张林肖承全周阳
Owner INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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