A miniaturized electronic module circuit system and its manufacturing method

Abstract

The invention discloses a miniaturized electronic module circuit system and a manufacturing method thereof. The system comprises a carrier plate used for the installation of components and a cavity frame of a hollow structure. The carrier plate is made of a plurality of layers of printed boards, and both surfaces of the carrier plate are respectively a device assembling surface. A plurality of hollow printed boards are overlapped to form the cavity frame, and a cavity used for accommodating the components is formed in the cavity frame. The peripheral size of the cavity frame is identical with that of the carrier plate. One side of the cavity frame is pasted to the carrier plate, and the other side is assembled to a function motherboard. The height of the cavity is no less than the largest height of the components installed in the cavity. The carrier plate is electrically connected with the cavity frame. The miniaturized electronic module circuit system and the manufacturing method thereof have the advantages that the assembling size of a module circuit unit is small, the electromagnetic interference resistance is good, the service lifetime is long, the manufacturing process is simple, and the production efficiency is high.

Description

technical field [0001] The invention relates to an electronic module circuit system, in particular to a miniaturized electronic module circuit system and a manufacturing method thereof. Background technique [0002] With the popularization of electronic products, the structure of products is developing towards the trend of miniaturization, portability, high reliability and low cost, so electronic circuits are repeatedly modularized and miniaturized. The miniaturization of the electronic circuit system can improve product development efficiency, reduce research and development risks, shorten the research and development cycle, and reduce the development cycle. At the same time, it can also reduce the volume of module products, reduce the assembly area, and improve the reliability of the entire product. However, different ways of realizing miniaturization have a great impact on the cost and performance of the final miniaturized products. [0003] At present, the existing mini...

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Problems solved by technology

However, the different implementation methods of miniaturization have a great impact on the cost and performance of the final miniaturized products.

[0003] At present, the existing miniaturized electronic module electronic systems generally have the disadvantages of large unit module circuit assembly volume, poor anti-electromagnetic interference ability of the module circuit, high process difficulty and cumbersome procedures.

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