Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Light-emitting diode epitaxial wafer and preparation method thereof

A technology of light-emitting diodes and manufacturing methods, applied in electrical components, nanotechnology, circuits, etc., can solve the problems of low reverse voltage of GaN-based LED epitaxial wafers, unable to effectively meet the needs of customers and enterprises, and improve reverse voltage. Effect

Active Publication Date: 2016-01-20
XIANGNENG HUALEI OPTOELECTRONICS
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the reverse voltage of the GaN-based LED epitaxial wafer prepared by the prior art is low, which cannot effectively meet the needs of customers and enterprises. Therefore, the present invention provides a new light-emitting diode epitaxial wafer and its manufacturing method to solve the above problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-emitting diode epitaxial wafer and preparation method thereof
  • Light-emitting diode epitaxial wafer and preparation method thereof
  • Light-emitting diode epitaxial wafer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Certain terms are used, for example, in the description and claims to refer to particular components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of components as a criterion for distinguishing. As mentioned throughout the specification and claims, "comprising" is an open term, so it should be interpreted as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect. The subsequent description of the specification is a preferred implementation mode for implementing the application, but the description is for the purpose of illustrating the general principle of the application, and is not intended...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a light-emitting diode epitaxial wafer and a preparation method thereof. The light-emitting diode epitaxial wafer is characterized by comprising a low-temperature buffer layer GaN, an undoped GaN layer, a uAl superlattice layer, an N-type GaN layer, a first barrier layer, a shallow quantum well layer, a multi-quantum well layer, an electronic barrier layer, an Mg-doped P-type GaN layer and a CTL layer, wherein the undoped GaN layer is located on the low-temperature buffer layer GaN; the uAl superlattice layer is located on the undoped GaN layer; the N-type GaN layer is located on the uAl superlattice layer; the first barrier layer is located on the N-type GaN layer; the shallow quantum well layer is located on the first barrier layer; the multi-quantum well layer is located on the shallow quantum well layer; the electronic barrier layer is located on the multi-quantum well layer; the Mg-doped P-type GaN layer is located on the electronic barrier layer; and the CTL layer is located on the Mg-doped P-type GaN layer. According to the light-emitting diode epitaxial wafer and the preparation method thereof disclosed by the invention, the backward voltage can be significantly improved by adding the uAl superlattice layer structure.

Description

technical field [0001] The present application relates to an epitaxial wafer of a light-emitting diode and a manufacturing method thereof, and more particularly, to an epitaxial wafer of a light-emitting diode with a reverse voltage boost and a manufacturing method thereof. Background technique [0002] A light-emitting diode (Light-EmittingDiode, referred to as LED) is a semiconductor electronic device that converts electrical energy into light energy. When electric current flows, electrons and holes recombine in it to emit monochromatic light. As a new type of high-efficiency, environmentally friendly and green solid-state lighting source, LED has the advantages of low voltage, low power consumption, small size, light weight, long life, high reliability, etc., and is being rapidly and widely used. [0003] Gallium nitride-based materials are usually used to make LEDs, also known as GaN-based LEDs. In recent years, research on GaN-based LEDs has continued to deepen, and i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/04H01L33/00B82Y40/00
CPCB82Y40/00H01L33/007H01L33/04
Inventor 向锦涛苏军刘为刚徐平
Owner XIANGNENG HUALEI OPTOELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products