Processing technology optimization method of ultrathin flexible plate

A technology of processing technology and optimization method, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of ultra-thin copper layer wrinkles, affect circuit production, and low product yield, so as to optimize processing technology and improve quality and yield rate, the effect of improving yield rate

Inactive Publication Date: 2016-01-20
SUIWA HIGH TECH ELECTRONICS INDS XIAMEN
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Problems solved by technology

[0006] Aiming at the problem that the ultra-thin copper layer will produce wrinkles during the processing of the existing ultra-thin flexible board, which will affect the production of the circuit and cause the problem that the yield rate of the product is very low
The invention proposes an improved processing technology optimization method for ultra-thin flexible boards, that is, the method of tearing off the protective copper after processing black holes, and using laser drilling instead of mechanical drilling to solve the problem of carbon in black holes. The problem of powder remaining on the surface of copper foil has been solved, and the processing technology has been optimized

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  • Processing technology optimization method of ultrathin flexible plate
  • Processing technology optimization method of ultrathin flexible plate
  • Processing technology optimization method of ultrathin flexible plate

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Embodiment Construction

[0023] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.

[0024] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0025] The traditional processing process of ultra-thin flexible boards is to tear off the protective copper foil after mechanical drilling, and then process black holes. After tearing off the protective copper foil, t...

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Abstract

The invention belongs to the technical field of processing of an ultrathin flexible plate, in particular relates to a processing technology optimization method of the ultrathin flexible plate. The invention discloses the processing technology optimization method of the ultrathin flexible plate, and a processing technology of the ultrathin flexible plate comprises the following steps of: A, cutting; B, laser drilling; C, hole blacking; D, a protective copper foil tearing; E, copper plating; and F, circuit fabricating. By the processing technology optimization method, the processing technology of the ultrathin flexible is optimized; by optimizing the processing technology, the problem of product folding and deformation is solved, the yield of circuit fabrication is greatly improved, and finally, the quality and the yield of the product are enhanced.

Description

technical field [0001] The invention belongs to the technical field of ultra-thin flexible board processing, and in particular relates to a method for optimizing the processing technology of ultra-thin flexible boards. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board, referred to as FPC) is a printed circuit board made of flexible insulating substrates (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be bent, rolled, and folded freely. The use of FPC can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras and other fields or products. [0003] Medical FPC products have their uniq...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/107
Inventor 刘美材
Owner SUIWA HIGH TECH ELECTRONICS INDS XIAMEN
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