Check patentability & draft patents in minutes with Patsnap Eureka AI!

Low-temperature environment-friendly conductive silver paste and preparation method and application thereof

A conductive silver paste, environmental protection technology, applied in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of poor conductivity, poor adhesion between conductive silver paste and substrate, etc. Achieve high conductivity, easy control of process conditions, and high adhesion

Active Publication Date: 2016-02-03
SHENZHEN UNIV
View PDF3 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the deficiencies in the above-mentioned prior art, provide a kind of low-temperature environment-friendly conductive silver paste and its preparation method and the application of the low-temperature environment-friendly conductive silver paste, to solve the poor conductivity of the existing low-temperature conductive silver paste, and its Technical problem of poor adhesion between conductive silver paste and substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-temperature environment-friendly conductive silver paste and preparation method and application thereof
  • Low-temperature environment-friendly conductive silver paste and preparation method and application thereof
  • Low-temperature environment-friendly conductive silver paste and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] Correspondingly, on the basis of the low-temperature environment-friendly conductive silver paste described above, the embodiment of the present invention also provides a preparation method of the low-temperature environment-friendly conductive silver paste according to the embodiment of the present invention. In one embodiment, the preparation method of the low-temperature environment-friendly conductive silver paste comprises the following steps:

[0031] S01: Weigh each component according to the components contained in the low-temperature environment-friendly conductive silver paste of the present invention;

[0032] S02: performing a first mixing treatment on the weighed organic carrier and the flake silver powder to prepare a first mixture;

[0033] S03: performing a second mixing treatment on the weighed ultra-fine silver and the first mixture to prepare a second mixture;

[0034] S04: performing a third mixing treatment on the weighed additive and the second mi...

Embodiment 1

[0045] This embodiment provides a low-temperature environment-friendly conductive silver paste, which is composed of an organic carrier, flake silver powder, ultrafine silver powder, silane coupling agent and putty powder.

[0046] Its preparation method is as follows:

[0047] S11: Dissolve 10 g of polyester resin into 45 g of propylene glycol methyl ether acetate, heat and stir at a constant temperature at 60° C. until completely dissolved, filter and cool to obtain an organic carrier;

[0048] S12: Weigh 55g of flaky silver powder with an average size of 2 μm and dissolve it into the aforementioned 28g of organic carrier, stir thoroughly with a mixer until the mixture is evenly mixed to obtain a silver powder mixture (1); weigh 25g of ultrafine silver powder with an average particle size of 20nm and add it to the In the silver powder mixture (1), fully stir with a mixer until the mixture is evenly mixed to obtain the silver powder mixture (2).

[0049] S13: Weigh 0.2g of s...

Embodiment 2

[0053] This embodiment provides a low-temperature environment-friendly conductive silver paste, which is composed of an organic carrier, flake silver powder, ultrafine silver powder, silane coupling agent and putty powder.

[0054] Its preparation method is as follows:

[0055] S21: Weigh 10 g of polyester resin and dissolve it in 35 g of ethylene glycol ether acetate solvent, heat and stir at a constant temperature at 60° C. until completely dissolved, filter and cool to obtain an organic vehicle.

[0056] S22: Weigh 48g of flaky silver powder with an average size of 2 μm and dissolve it into the aforementioned 32g of organic carrier, stir fully with a mixer until mixed to obtain a silver powder mixture (1); weigh 18g of ultrafine silver powder with an average particle size of 20nm and add it to the In the silver powder mixture (1), fully stir with a mixer until the mixture is evenly mixed to obtain the silver powder mixture (2).

[0057] S23: Weigh 0.1g of silane coupling a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Average sizeaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Granularityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a low-temperature environment-friendly conductive silver paste and a preparation method and application thereof. The silver paste contains the following parts (by mass): 45%-55% of silver flakes, 10%-25% of superfine silver powder, 20%-35% of an organic carrier, and 2%-10% of an additive. The silver paste has low-temperature setting and high-conductivity performances and a strong adhesive force for binding a substrate, and enlarges the application range. The method enables a material-mixing processing condition to be easy to control, is low in the requirements for equipment, effectively guarantees the performance stability of the conductive silver paste, improves the production efficiency of the silver paste, and reduces the production cost of the silver paste.

Description

technical field [0001] The invention belongs to the field of microelectronic connection materials, and in particular relates to a low-temperature environment-friendly conductive silver paste, a preparation method thereof and an application of the low-temperature environment-friendly conductive silver paste. Background technique [0002] In recent years, with the rapid development of the electronics industry, the demand for membrane switches, flexible printed circuit boards, electromagnetic shielding, potentiometers, radio frequency identification systems, solar cells, etc. The development and application of key functional materials for devices has also received widespread attention. According to analysis, only the conductive silver paste market has a market size of billions of dollars every year. During the rapid development of the information industry, slurry plays an important role as a key material. High performance and low cost can not only greatly improve the competit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01B1/22H01B13/00
Inventor 邹继兆刘长黄远珊曾燮榕罗晴
Owner SHENZHEN UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com