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Binding gold finger compensation method

A compensation method, finger technology, applied in the direction of electrical connection formation of printed components, electrical components, printed circuit liquid treatment, etc., can solve the problem that the effective area of ​​welding cannot be satisfied

Active Publication Date: 2016-02-24
江西弘信柔性电子科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the camera pixels of mobile phones are getting denser and the lines are getting denser, it has developed to a surface copper thickness of 0.030, a bonding finger width of 0.08mm, and a line spacing of 0.08mm. The normal design compensation cannot meet the effective area of ​​welding, so a bonding is designed. Gold finger compensation method is particularly important

Method used

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Embodiment Construction

[0014] The invention provides a binding gold finger compensation method, which includes the following steps: S1: drilling, S2: copper plating, S3: dry film pretreatment, S4: pattern transfer, S5: line etching-DES, S6: AOI Inspection, S7: Printing solder mask (including pre-treatment), S8: Surface treatment, S9: Forming, S10: Electrical testing, S11: Finished product inspection-FQC.

[0015] The above-mentioned step S4: the technological process of pattern transfer is followed by dry film pressing and circuit exposure.

[0016] Such as figure 1 The step S5 shown: line etching-DES is to slow down the speed of liquid medicine exchange in the gap by reducing the gap between the adjacent line rear ends 17 under the premise that the line front end 16 remains unchanged, so that the etched line The rear end 17 is at a right angle, thereby ensuring that the area of ​​the binding fingers after etching is consistent with the area of ​​the binding fingers before etching.

[0017] The ab...

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Abstract

The invention relates to a binding gold finger compensation method, which comprises the following steps: (S1) drilling; (S2) copper plating; (S3) dry film pretreatment; (S4) pattern transferring; (S5) line etching-DES; (S6) AOI detection; (S7) solder resist printing (including pretreatment); (S8) surface treatment; (S9) molding; (S10) electrical testing; and (S11) finished product inspection-FQC. According to the binding gold finger compensation method, the liquid medicine exchange speed in a gap is reduced by reducing the gap between the rear ends of the adjacent lines; and the rear ends of the etched lines are in a right angle, so that the condition that the area of the etched binding finger is consistent with that of the binding finger before being etched is ensured.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a compensation method for binding golden fingers. Background technique [0002] With the development of electronic products towards thinner, shorter and multifunctional, flexible and rigid boards are more and more used in industries, medical equipment, mobile phones, LCD TVs and other consumer products due to their excellent durability and flexibility. on electronic products. As the camera pixels of mobile phones are getting denser and the lines are getting denser, it has developed to a surface copper thickness of 0.030, a bonding finger width of 0.08mm, and a line spacing of 0.08mm. The normal design compensation cannot meet the effective area of ​​welding, so a bonding is designed. Gold finger compensation method is particularly important. Contents of the invention [0003] The technical purpose of the present invention is to slow down the liquid exchange speed in th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40
CPCH05K3/00H05K3/0085H05K3/403H05K2203/0338
Inventor 李胜伦钱小进黎军郑冬华
Owner 江西弘信柔性电子科技有限公司
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