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Coating bonding wire and manufacturing method thereof

A manufacturing method and bonding wire technology, which are applied in the direction of insulating conductors/cables, cables, insulated conductors, etc., can solve the problem of difficulty in removing the insulating layer, etc., so as to improve the packaging density and packaging yield, and reduce the arc height. Effect

Inactive Publication Date: 2016-03-02
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even in the case of coated bonding wires with insulation formed of heat-resistant epoxy resin, the insulating layer has to be removed by means of radiation treatment, so that the bonding wire can be easily bonded without melting the bonding wire and ensuring stability. Difficult to remove insulation

Method used

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  • Coating bonding wire and manufacturing method thereof
  • Coating bonding wire and manufacturing method thereof
  • Coating bonding wire and manufacturing method thereof

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Embodiment Construction

[0016] The following is a detailed description of this product in conjunction with the accompanying drawings.

[0017] Such as figure 1 and figure 2 As shown, a coated bonding wire includes a bonding wire 1 and an insulating layer 2, the insulating layer 2 covers the periphery of the bonding wire 1, and the material of the insulating layer 2 is terephthalic acid, polyethylene terephthalate Butylene phthalate, poly-4-methyl-1-pentene, or polyaryletherketone.

[0018] The bonding wire 1 is made of gold, aluminum, copper, silver or palladium-plated copper.

[0019] The insulating layer 2 completely covers the bonding wire 1, or covers the bonding wire 1 at intervals, such as image 3 shown.

[0020] A method for manufacturing a coated bonding wire. In the method, the insulating layer 2 is formed by spraying or chemical vapor deposition.

[0021] Such as image 3 As shown, L and D are equivalent or unequal values, and the interval coverage of the insulating layer 2 can play...

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Abstract

The invention discloses a coating bonding wire and a manufacturing method thereof. An insulation layer of a coating bonding wire includes a polymeric material, the insulation layer under the condition of high temperature can be decomposed without any damage to the bonding wire. Through the coating bonding wire and the method, a short circuit problem of metal wires can be effectively solved, and packaging density and a packaging yield are further improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging related to a wire bonding process, in particular to a coated bonding wire and a manufacturing method thereof. Background technique [0002] With the continuous advancement of semiconductor technology and market demand, the development of chip packaging technology is changing with each passing day. It is constantly emerging that the traditional wire-bonding interconnection technology is becoming less and less suitable for the requirements of high-density packaging technology, and high-density bonding wires have cross-wire short circuits. Moreover, as the new fingerprint identification technology requires ultra-low wire arcs, it is necessary to lower the bonding wire to a very close distance from the chip, but for traditional bonding wires, it is easy to cause a short circuit between the bonding wire and the chip. Thus affecting product performance. [0003] In order to solve this ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01B7/02H01B13/06H01B13/16
CPCH01L24/45H01L2224/4556H01L2224/45565H01L2224/45H01L2924/00012
Inventor 李涛涛于大全刘宇环
Owner HUATIAN TECH XIAN