Soldering tin preheating principle and application
A preheating and soldering technology, applied in electric heating devices, welding equipment, metal processing equipment, etc., can solve the problems of solder joint explosion, easy generation of bubbles in solder flux, short circuit of electronic components, etc., to reduce short circuit and reduce spatter The effect of quantity and operation safety
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Embodiment 1
[0021] Embodiment 1. The tin wire with a diameter of 0.8mm is preheated. Before the tin wire layer is preheated, the sealing damage treatment is first performed. The tin wire does not set the preheating temperature. The temperature set when the tin wire is soldered with a high-temperature soldering iron is At 380°C, the amount of tin beads produced is less than 60%.
Embodiment 2
[0022] Embodiment 2. The tin wire with a diameter of 0.8 mm is preheated. The sealing damage treatment is not performed before the tin wire layer is preheated. The tin wire preheating time is set to 2 minutes, and the tin wire preheating temperature is set to 65 ℃, the temperature of the preheated soft tin wire for high-temperature soldering iron soldering is 380 ℃, and the amount of tin beads produced is less than 15%.
Embodiment 3
[0023] Embodiment 3. Preheating the tin wire with a diameter of 0.8 mm. Before the tin wire layer is preheated, the sealing damage treatment is first performed. The tin wire preheating time is set to 2 minutes, and the tin wire preheating temperature is set to 65 ℃, the temperature of the preheated soft tin wire for high-temperature soldering iron soldering is 380 ℃, and the amount of tin beads produced is less than 5%. It can be seen that before the tin wire is preheated, the sealing damage treatment is first performed on the tin wire layer. The optimal time for preheating the tin wire is 2 minutes, and the optimal temperature for preheating the tin wire is 65°C. When the optimum temperature of the final soft tin wire for high-temperature soldering iron soldering is selected as 380°C, under this condition, it not only greatly reduces the amount of solder balls produced, but also alleviates the rapid expansion of the flux and weakens the soldering process. The medium flux is r...
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