Design and manufacture method applicable to protection of aluminum substrate during copper-deposited plate electroplating

Abstract

The invention relates to a design and manufacture method applicable to protection of an aluminum substrate during copper-deposited plate electroplating. The method sequentially comprises the following steps: (1) fabricating a multi-layer structure aluminum substrate with a blind hole; (2) forming a heat-conducting glue layer on an aluminum surface of the aluminum substrate in a screen printing manner; (3) baking the heat-conducting glue layer and thoroughly solidifying heat-conducting glue on the aluminum surface of the aluminum substrate; (4) carrying out copper-deposited plate electroplating on the aluminum substrate; (5) grinding off the heat-conducting glue layer on the aluminum surface of the aluminum substrate through a grinding tool; and (6) pasting a high-temperature protection film on the aluminum surface of the aluminum substrate of which the heat-conducting glue layer is ground off. The aluminum surface of the aluminum substrate is protected by a heat-conducting glue screen printing method; the phenomenon that the aluminum surface of the aluminum substrate is corroded during copper-deposited plate electroplating can be thoroughly overcome; a liquid medicine cylinder can also be relatively well prevented from being polluted by substances which are generated by reaction of the aluminum surface and a liquid medicine; and the copper-deposited plate electroplating quality of the aluminum substrate can also be ensured.

Description

technical field [0001] The invention belongs to the technical field of manufacturing metal-based printed circuit boards, and in particular relates to a design and manufacturing method suitable for protecting aluminum substrates and sinking copper boards. Background technique [0002] Today, with the rapid development of electronic technology, PCB, as the basis of electronic technology development, has also been developed and applied unprecedentedly. Among them, high heat dissipation metal substrates are more and more widely used, such as integrated circuits, automobiles, office automation, high-power electrical equipment, Metal substrates have appeared in power supply equipment, LED lighting and other fields. Compared with FR-4 traditional hard boards, metal substrates have nearly 10 times higher thermal conductivity, high breakdown voltage, high surface resistivity, high dimensional stability, and excellent high temperature resistance. What the customer needs. Among them,...

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Problems solved by technology

Among them, the multi-layer blind-hole aluminum substrate as a special board has also begun to be designed and used by customers. At present, it is difficult to directly complete the production of the copper-immersion circuit in the PCB factory for this kind of multi-layer blind-hole aluminum substrate that requires copper plating. Aluminum will pollute the liquid medicine tank when the copper plate is electrocuted, and the aluminum surface is also easily corroded by the liquid medicine. Usually, a layer of high-temperature protective film is attached to protect the aluminum surface. It is difficult to resist the erosion of high-temperature liquid medicine, and it is prone to blistering and other adverse phenomena, which cannot protect the aluminum surface very well.

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