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Manufacturing method of copper/diamond composite material with high thermal conductivity

A composite material, high thermal conductivity technology, applied in the field of composite materials, can solve problems such as insufficient thermal conductivity potential, and achieve the effects of excellent comprehensive performance, low thermal expansion coefficient, and high thermal conductivity

Inactive Publication Date: 2016-04-13
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of diamond is as high as 2000W / mK, and its thermal conductivity potential has not yet been fully realized.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The copper block and the titanium block are smelted by a vacuum induction melting method to obtain a copper-titanium alloy ingot with a composition of 99.5wt.% Cu-0.5wt.% Ti. The diamond particles with a particle size of 230 μm are packed in the mold, the filled mold is placed in the graphite sleeve and the composition is 99.5wt.%Cu-0.5wt.%Ti alloy block is placed on the top of the mold, and then The whole filled mold is placed in the induction heating zone of the high-pressure gas-assisted infiltration device, and the vacuum system and the pressurized inflation system are connected. Turn on the vacuum system and vacuum the furnace body until the vacuum degree is less than 0.1Pa. Turn on the circulating water, start the induction heater, and heat the mold to 1150°C for 15 minutes. Turn on the booster gas system to inject high-purity argon into the furnace body. When the gas pressure in the furnace reaches 1.0MPa, turn off the booster gas system and keep the temperature...

Embodiment 2

[0020] The copper block and the titanium block are smelted by a vacuum induction melting method to obtain a copper-titanium alloy ingot with a composition of 99.7wt.% Cu-0.3wt.% Ti. Pack the diamond particles with a particle size of 165 μm in the mold, put the filled mold in the graphite sleeve and put the alloy block of 99.7wt.% Cu-0.3wt.% Ti on the top of the mold, and then The whole filled mold is placed in the induction heating zone of the high-pressure gas-assisted infiltration device, and the vacuum system and the pressurized inflation system are connected. Turn on the vacuum system and vacuum the furnace body until the vacuum degree is less than 0.1Pa. Turn on the circulating water, start the induction heater, and heat the mold to 1150°C for 10 minutes. Turn on the pressurized gas filling system to inject high-purity argon into the furnace body. When the gas pressure in the furnace reaches 2.5MPa, turn off the booster gas filling system and keep the temperature and pre...

Embodiment 3

[0022] The copper block and the titanium block are smelted by a vacuum induction melting method to obtain a copper-titanium alloy ingot with a composition of 98.0wt.% Cu-2.0wt.% Ti. The diamond particles with a particle size of 230 μm are packed in the mold, the filled mold is placed in the graphite sleeve and the alloy block with a composition of 98.0wt.% Cu-2.0wt.% Ti is placed on the top of the mold, and then The whole filled mold is placed in the induction heating zone of the high-pressure gas-assisted infiltration device, and the vacuum system and the pressurized inflation system are connected. Turn on the vacuum system and vacuum the furnace body until the vacuum degree is less than 0.1Pa. Turn on the circulating water, start the induction heater, and heat the mold to 1150°C for 15 minutes. Turn on the booster gas system to inject high-purity argon into the furnace body. When the gas pressure in the furnace reaches 1.0MPa, turn off the booster gas system and keep the te...

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Abstract

The invention discloses a manufacturing method of a copper / diamond composite material with the high thermal conductivity and belongs to the technical field of composite materials. Alloy element titanium is added on a copper matrix, and the copper / diamond composite material is manufactured through an air-pressure infiltration method. According to the optimum manufacturing parameters, the content of alloy element titanium is 0.5 wt.%, the infiltration temperature is 1,150 DEG C, the heat preservation pressure is 1.0 MPa, and the temperature preservation time is 30 min. The thermal conductivity of the manufactured copper / diamond composite material is 752 W / mK, and the coefficient of thermal expansion is 6.5*10<-6> / K. By the adoption of the manufacturing method of the copper / diamond composite material, a good technical solution is provided for efficient heat dissipation of large-power devices.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to a method for preparing a copper / diamond composite material with high thermal conductivity. Background technique [0002] The miniaturization and integration of electronic components has led to a sharp increase in the heat flux of power devices, and accordingly requires electronic packaging materials to have high thermal conductivity in order to improve the heat dissipation capability of the thermal control system. Diamond is the material with the highest thermal conductivity in nature, and metallic copper also has high thermal conductivity, so the copper-based (copper / diamond) composite material dispersed with diamond particles has good thermal conductivity potential. However, due to the lack of chemical reaction between diamond and copper and the large wetting angle, the interface between the two is poor, and the reported thermal conductivity of copper / diamond compos...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C26/00C22C1/02
CPCC22C9/00C22C1/02C22C26/00
Inventor 王西涛李建伟张海龙张洋
Owner UNIV OF SCI & TECH BEIJING
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