Acoustic surface wave filter and manufacturing method thereof

A surface acoustic wave and manufacturing method technology, applied in the direction of electrical components, impedance networks, etc., can solve problems such as tip effect, surface acoustic wave damage, and interdigital strip breakage, so as to avoid breakdown phenomenon, reduce field strength, The effect of increasing the center frequency

Active Publication Date: 2016-04-13
BEIJING MXTRONICS CORP +1
View PDF6 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The interdigitated strips are too thin. In the SAW propagation project, due to the high ambient temperature, the tip effect is prone to occur, causing the interdigitated strips to break, resulting in complete damage to the SAW
Therefore, it is impossible to meet the needs of the rapid development of surface acoustic waves only by using advanced semiconductor planar technology.
In addition, the thinner the fingers are, the greater the resistance will be, which will generate greater heat energy, which will melt and break the thin fingers, completely destroying the surface acoustic wave, which is very important for the production of high-power Disadvantages of surface acoustic wave devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Acoustic surface wave filter and manufacturing method thereof
  • Acoustic surface wave filter and manufacturing method thereof
  • Acoustic surface wave filter and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Such as figure 1 As shown, a surface acoustic wave filter includes a base 2 and a cap 9 .

[0035] The substrate 2 has a transmitting IDT 3, a receiving IDT 4, a ground wire 7, a signal input port 5 and a signal output port 6, such as figure 2 is a top view of the structure on the substrate 2. The ground wire 7 includes a first ground wire 71, a second ground wire 72, a third ground wire 73 and a fourth ground wire 74;

[0036] The transmitting IDT 3 and the receiving IDT 4 are rectangular interdigital electrodes, which are composed of two interdigitated comb electrodes, and the shape of each interdigital generally adopts a rectangle. The line width of the interdigital transducer used in the present invention is 1 μm to 2 μm, the interdigital distance is 1 μm to 2 μm, and the length of the aperture (the part where two comb electrodes are inserted) is 300 μm to 350 μm. The corners of the common electrodes of the comb electrodes of the transmitting IDT 3 and the recei...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

An acoustic surface wave filter comprises a base (2) and a cap (9), a filter pattern layer is arranged on the base (2), and the filter pattern layer comprises a sending interdigital transducer (3), a receiving interdigital transducer (4), ground wires (7), a signal input port (5) and a signal output port (6); the ground wires (7) comprise a first ground wire (71) connected with the sending interdigital transducer (3) and a second ground wire (72) connected with the receiving interdigital transducer (4); the sending interdigital transducer (3) and the receiving interdigital transducer (4) are rectangular interdigital electrodes formed by two comb electrodes which are interdigitated; corners of common terminals of the comb electrodes of the sending interdigital transducer (3) and the receiving interdigital transducer (4) are round corners. In order to effectively avoid a point effect, corner rounding treatment is adopted at joints of the ground wires and the interdigital electrodes, and the point field intensity is effectively reduced, thereby avoiding punch-through and improving reliability of a device.

Description

technical field [0001] The invention relates to a surface acoustic wave (SAW) filter and a manufacturing method thereof, belonging to the technical field of radio frequency MEMS. Background technique [0002] Surface Acoustic Wave (SAW, SurfaceAcousticWave) is an elastic wave that is generated and propagated on the surface of a piezoelectric substrate material, and whose amplitude decreases rapidly as it goes deeper into the substrate material. With its unique advantages, such as light weight, small size and high reliability, it is widely used in many fields such as mobile communication, radio and television, non-destructive testing, identification and positioning, navigation and telemetry. For example, the dual-band SAW filter with 60MHz bandwidth applied to a 1.0GHz PCS terminal and the SAW filter for dual-mode portable mobile phones developed by Fujitsu (patent publication number JP2005210158A). However, the center frequency f of the surface acoustic wave filter made of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/64
CPCH03H9/6413
Inventor 王碧张富强杨静李光北孟美玉孙俊敏刘尚禹
Owner BEIJING MXTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products