A ring array transducer and its preparation method and ultrasonic endoscope
A ring array and transducer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high process requirements, difficult production, low efficiency, etc., to ensure product quality, high quality, reduce The effect of short lead times
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] An ultrasonic transducer generally includes at least an ultrasonic vibrator and electrode leads. The ultrasonic vibrator is an acoustic-electric conversion device, and the electrode leads connect the electrical signal converted by the ultrasonic vibrator to the outside. Among them, the annular array transducer requires the transducer vibrator to be arranged in 360 degrees, and the vibrator units must not be connected, and the arrangement is neat and consistent, and the welding process of the circuit and the vibrator unit requires high requirements, difficult production, low efficiency, and low cost. high. Therefore, how to provide a ring-shaped ultrasonic transducer with good performance and high quality, which has low difficulty in production process and high production efficiency is a technical problem to be solved urgently.
[0024] This embodiment provides a method for manufacturing an annular array transducer, which can arrange the vibrator units neatly and consis...
Embodiment 2
[0041] This embodiment provides a ring array transducer, such as Figure 4 , 5 As shown, it includes at least: a ring-shaped ultrasonic vibrator layer 21, a flexible circuit layer 22.
[0042] The ultrasonic vibrator layer 21 includes a plurality of ultrasonic vibrator units 210 . As shown in the figure, the ultrasonic vibrator units 210 are arranged in a circular array that is not connected, neatly and uniformly concentric and equidistant.
[0043] The flexible circuit layer 22 includes a first portion 221 and a second portion 222,
[0044]The first part 221 of the flexible circuit layer is attached to the back side of the ultrasonic vibrator unit 210 and electrically connected;
[0045] The second part 222 of the flexible circuit layer is a part of the first part 221 that extends in the longitudinal direction and is longer than the part of the ultrasonic vibrator layer 21, and the second part 222 of the flexible circuit layer is along the distance between the ultrasonic vi...
Embodiment 3
[0052] Endoscopic ultrasonography (EUS) is an inspection technology that combines endoscopy and ultrasound. A miniature high-frequency ultrasound probe is placed on the top of the endoscope. The real-time scanning of ultrasound under the endoscope can obtain the histological characteristics of the cavity and the ultrasound images of the surrounding adjacent organs, thereby further improving the diagnostic level of endoscopy and ultrasound.
[0053] This embodiment provides an ultrasonic endoscope, which at least includes the annular array transducer described in Embodiment 2, or the transducer prepared according to the method described in Embodiment 1.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


