Three-dimensional molding device and method based on film substrate

Abstract

The invention discloses a three-dimensional molding device and method based on a film substrate. The device comprises a feeding mechanism, an exposure mechanism, a supporting mechanism and a separating mechanism, wherein photosensitive material layers are sent to corresponding exposure areas through the feeding mechanism and then are exposed through the exposure mechanism so that solidification generation of each layer of specific pattern can be achieved, and the patterns on all layers are stacked to form a required part on the supporting mechanism; separation and exposure are conducted synchronously, a film substrate material layer is gradually separated from the top surface of the formed part on the supporting mechanism as the separating mechanism moves rightwards under the action of tension, and unexposed photosensitive material layers are stripped off to the space outside the supporting mechanism at the same time. By conducting exposure and separation synchronously, working efficiency can be improved, and requirements for large breadth, high efficiency, high precision and low cost during three-dimensional entity manufacturing are met.

Description

Technical field [0001] The invention relates to the technical field of light curing molding, in particular to a three-dimensional molding device and method based on a film substrate. Background technique [0002] Layered stacking is the main realization method of 3D molding technology at present. Its principle is simple, structure is reliable, and data processing method is mature, so it has been widely used. The layer-to-layer superposition is based on different physical and chemical materials and methods, such as glue bonding, hot melt lamination, laser sintering, and photopolymerization. The photopolymerization method is based on the principle of photochemical reaction, without mechanical force and heating process, and has the highest molding accuracy. [0003] The typical material for photopolymerization is photosensitive curing resin, which is a liquid suspension of short molecular chains before polymerization. When irradiated by electromagnetic radiation of a specific wavelen...

AI Technical Summary

Problems solved by technology

[0005] There are two main limitations of the above method. One is the large consumption of resin, because the height of the moldable parts depends on the depth of the resin liquid, which requires a large amount of resin to be stored in the liquid tank, and these unused resins are prone to premature failure. Photosensitive curing, while exposure to air can easily lead to deterioration, resulting in unnecessary material loss

Second, the molding speed is slow, because the photosensitive resin often has a large viscosity, its self-leveling speed is slow, and the surface accuracy after leveling is difficult to control

When processing parts with closed cavity, it is easy to make unnecessary resin liquid be closed or remain inside the part, which will affect the final molding accuracy of the part

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