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Epoxy resin composition for semiconductor encapsulation, mounting structure for semiconductor, and production method of the mounting structure for semiconductor

A technology of epoxy resin and manufacturing method, which is applied to epoxy resin coatings, semiconductor devices, semiconductor/solid-state device parts, etc. excellent effect

Inactive Publication Date: 2016-05-18
NAGASE CHEMTEX CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, when the semiconductor sealing material exceeds the glass transition temperature, the coefficient of thermal expansion becomes extremely large, and the dimensional change becomes large

Method used

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  • Epoxy resin composition for semiconductor encapsulation, mounting structure for semiconductor, and production method of the mounting structure for semiconductor
  • Epoxy resin composition for semiconductor encapsulation, mounting structure for semiconductor, and production method of the mounting structure for semiconductor
  • Epoxy resin composition for semiconductor encapsulation, mounting structure for semiconductor, and production method of the mounting structure for semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0085] "Examples 1-5, Comparative Examples 1-6"

[0086] The respective components shown in Table 1 were blended in respective blending amounts, and stirred sufficiently at normal temperature (25° C.) to prepare a uniform epoxy resin composition. Each of the obtained epoxy resin compositions was compression-molded on a silicon wafer with a diameter of 12 inches and a thickness of 300 μm on which a plurality of semiconductor chips of 5 mm square were mounted, to obtain a semiconductor package structure. Compression molding was performed at 110° C. for 10 minutes using a lower mold having a cavity having a diameter of 12 inches and a height of 0.4 mm, followed by post-curing at 170° C. for 120 minutes.

[0087]

[0088] For the epoxy resin compositions of Examples 1 to 5 and Comparative Examples 1 to 6, their cured products, or the semiconductor package structures sealed by the epoxy resin composition, and the singulated semiconductor packages obtained by singulating them Str...

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Abstract

Provided is an epoxy resin composition for semiconductor encapsulation. The composition includes (A) 100 parts by mass of epoxy resin containing 10 to 45 mass% of novolac-type epoxy resin; (B) 50 to 150 parts by mass of acid anhydride; (C) 2 to 12 parts by mass of a curing accelerator; (D) 5 to 50 parts by mass of silicone gel or silicone oil; and (E) molten silica as spherical particles with an average particle size of 2 to 30 [mu]m, in which the content of the molten silica (E) is 80-92 mass% and the viscosity of the molten silica (E) at 25 DEG C and a shear rate of 2.5 s<-1> is 1000 Pa.s or less.

Description

technical field [0001] The present invention relates to an epoxy resin composition, and particularly to an epoxy resin composition suitable as a chip-on-wafer (CoW) type semiconductor sealing material. Background technique [0002] In recent years, along with progress in the miniaturization of electronic equipment, there has been an increasing demand for thinner and smaller semiconductor products. Therefore, a packaging technology called wafer level chip size package (WaferLevelChipSizePackage), which mounts and seals a plurality of semiconductor bare chips in the state of a semiconductor wafer before singulation, has attracted attention. Thereafter, the laminate of the semiconductor sealing material and the semiconductor wafer can be singulated (diced) to obtain chip-level semiconductor products. Since such a semiconductor product has the same mounting area as the semiconductor bare chip, it is easier to miniaturize than the general method of mounting and sealing the semic...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/36C08K5/00C08K5/09H01L23/29H01L23/31H01L25/065H01L25/07H01L25/18
CPCC08L63/00H01L24/94H01L24/97H01L25/0657H01L25/50H01L2224/0557H01L2224/14181H01L2224/16146H01L2224/32145H01L2224/73204H01L2224/92125H01L2224/94H01L2224/97H01L2924/3511H01L2225/06513H01L2225/06541H01L2225/06568H01L23/295H01L23/296C08K2201/003C09D163/00C08L2203/206C08G59/686C08K3/36C08L63/04C08L83/04H01L2224/81H01L2224/83H01L2224/16145H01L2924/00C08K5/09H01L23/293
Inventor 北川伟之藤井康仁菅克司
Owner NAGASE CHEMTEX CORPORATION
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