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Low-temperature-resistant packaging material and preparation method therefor

A technology of packaging materials and low temperature resistance, which is applied in the field of packaging materials to achieve the effects of economical and easy-to-obtain raw materials, less industrial pollutants, and high durability

Inactive Publication Date: 2016-06-01
SUZHOU JIN TENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially for some special purposes, the gaps in the packaging materials required in special environments are quite obvious, such as packaging materials required for the storage and transportation of items in high temperature and low temperature environments. Therefore, it is necessary to develop a packaging material with better Low temperature resistant packaging materials with excellent performance and no harm to the environment are particularly necessary

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Weigh 15 parts of polyimide, 10 parts of polytetrafluoroethylene, 10 parts of polychlorotrifluoroethylene, 5 parts of nitrile, 2 parts of polysulfone, 2 parts of silicone rubber, 5 parts of methylphenyl vinyl silicon 10 parts of silicone gel, 5 parts of asbestos, 5 parts of polyester, 5 parts of epoxy resin, 5 parts of polycarbonate, 5 parts of cycloheptene, 2 parts of aziridine, mix well;

[0024] (2) Add the above components into a rotor mixer and stir at a stirring speed of 300 rpm, while slowly adding 5 parts of stearic acid sodium salt and 5 parts of triethanolamine;

[0025] (3) After all the components are added, heat the rotor mixer to 200°C, the stirring speed is 600 rpm, and continue stirring for 120 minutes;

[0026] (4) Extruding the raw material slurry obtained above;

[0027] (5) Cool the extruded material to room temperature, dry it, and then pull it up and shape it at 150°C to obtain the finished product.

[0028] Table 1 shows the results of the t...

Embodiment 2

[0030] (1) Weigh 25 parts of polyimide, 12 parts of polytetrafluoroethylene, 12 parts of polychlorotrifluoroethylene, 8 parts of nitrile, 4 parts of polysulfone, 4 parts of silicone rubber, 8 parts of methylphenyl vinyl silicon 15 parts of silicone gel, 10 parts of asbestos, 8 parts of polyester, 8 parts of epoxy resin, 10 parts of polycarbonate, 8 parts of cycloheptene, 4 parts of aziridine, mix well;

[0031] (2) Add the above components into the rotor mixer and stir at a stirring speed of 300 rpm, while slowly adding 8 parts of alkylphenol polyoxyethylene ether and 8 parts of stannous chloride;

[0032] (3) After all the components are added, heat the rotor mixer to 200°C, the stirring speed is 600 rpm, and continue stirring for 120 minutes;

[0033] (4) Extruding the raw material slurry obtained above;

[0034] (5) Cool the extruded material to room temperature, dry it, and then pull it up and shape it at 180°C to get the finished product.

[0035] Table 1 shows the resu...

Embodiment 3

[0037] (1) Weigh 30 parts of polyimide, 15 parts of polytetrafluoroethylene, 15 parts of polychlorotrifluoroethylene, 10 parts of nitrile, 5 parts of polysulfone, 5 parts of silicone rubber, and 10 parts of methylphenyl vinyl silicon 20 parts of silicone gel, 15 parts of asbestos, 10 parts of polyester, 10 parts of epoxy resin, 15 parts of polycarbonate, 10 parts of cycloheptene, 5 parts of aziridine, mix well;

[0038] (2) Add the above components into a rotor mixer and stir at a stirring speed of 300 rpm, while slowly adding 10 parts of benzyldimethylphenol polyoxyethylene ether and 10 parts of cobalt naphthenate;

[0039] (3) After all the components are added, heat the rotor mixer to 200°C, the stirring speed is 600 rpm, and continue stirring for 120 minutes;

[0040] (4) Extruding the raw material slurry obtained above;

[0041] (5) Cool the extruded material to room temperature, dry it, and then pull it up and shape it at 200°C to get the finished product.

[0042] Tab...

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PUM

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Abstract

The invention discloses a low-temperature-resistant packaging material. The packaging material contains the following raw materials in parts by weight: 15-30 parts of polyimide, 10-15 parts of polytetrafluoroethylene, 10-15 parts of polytrifluorochloroethylene, 5-10 parts of butyronitrile, 2-5 parts of polysulfone, 2-5 parts of silicon rubber, 5-10 parts of methylphenylvinyl silicone, 10-20 parts of organic silicone gel, 5-15 parts of asbestos, 5-10 parts of polyester, 5-10 parts of epoxy resin, 5-15 parts of polycarbonate, 5-10 parts of cycloheptene, 2-5 parts of aziridine, 5-10 parts of an emulsifier and 5-10 parts of an accelerant. Meanwhile, the invention discloses a preparation method for the low-temperature-resistant packaging material.

Description

technical field [0001] The invention relates to the technical field of packaging materials, in particular to a low-temperature resistant packaging material and a preparation method thereof. Background technique [0002] Packaging materials refer to the materials used to make packaging containers, packaging decoration, packaging printing, packaging and transportation to meet product packaging requirements, including metal, plastic, glass, ceramics, paper, bamboo, wild mushrooms, natural fibers, Main packaging materials such as chemical fibers and composite materials, and auxiliary materials such as coatings, adhesives, strapping tapes, decorations, and printing materials. [0003] However, with the development of social industrialization, all walks of life need to involve a wide variety of packaging materials, and at the same time, the demand for corresponding packaging materials has risen sharply. Especially for some special purposes, the gaps in the packaging materials req...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L27/18C08L27/12C08L9/02C08L81/06C08L83/04C08L67/02C08L63/00C08L69/00C08K13/04C08K7/12C08K5/5425
CPCC08L79/08C08L27/18C08L2205/02C08L2205/035C08L27/12C08L9/02C08L81/06C08L83/04C08L67/02C08L63/00C08L69/00C08K13/04C08K7/12C08K5/5425
Inventor 孙政良
Owner SUZHOU JIN TENG ELECTRONICS TECH
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