Preparation method of printing-grade conductive adhesive

Abstract

The invention discloses a preparation method of a printing-grade conductive adhesive. The preparation method comprises the following steps: firstly, adding 70-93% of glue, 4-20% of conductive powder particles and 2-10% of pure water into a reaction still, wherein the conductive powder particles comprise first metal conductive power particles and second metal conductive power particles, and the first metal conductive power particles are nickel powder; then, stirring by a stirrer; finally, heating and drying a solution in the stirrer through the reaction still to prepare the printing-grade conductive adhesive. Compared with a preparation method of a traditional conductive adhesive, the preparation method has the advantages of cheap and abundant raw materials and relatively low preparation cost, is friendly to environment, does not need additional die cutting and does not add any auxiliary materials. The prepared conductive adhesive has high integral viscosity and low resistance value, can be directly printed on a product and is free from the limitation of a glue structure, multiple points of conductive adhesive of one piece of product can be finished by one-time printing, the conductive adhesive has viscidity after being dried, and the conductive adhesive has good market application value.

Description

technical field [0001] The invention relates to the technical field of conductive adhesive preparation, in particular to a preparation method of printing-grade conductive adhesive. Background technique [0002] Currently, a large number of passive components and high-density multilayer packages are mounted on printed circuit boards (PCBs) due to thickness reduction and functionalization of electronic products, and this trend will continue in the future. [0003] Basically, the PCB plays the role of connecting various electronic components to the PCB substrate or supporting the components according to the circuit design of the wiring. And, drilling and plating methods are most widely used as a method of transmitting interlayer signals and substrate power. However, in the case where the number of holes for connecting interlayer signals increases and thin PCBs are manufactured, encapsulation and bonding of electronic components and components by conductive glue has great advan...

AI Technical Summary

Problems solved by technology

[0004] However, there are also some problems in the preparation process of the existing conductive adhesives. For example, additional die-cutting is required during the preparation, and more auxiliary materials are used, which not only makes the preparation cost higher, but also wastes the auxiliary materials and easily causes damage to the environment. Pollution

Moreover, the overall viscosity of the prepared conductive adhesive is not high, and its X, Y direction resistance and Z direction resistance value are relatively high, which affects the use of electronic components to a certain extent.

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