Pulse laser processing-based novel positive rake diamond abrasive tool manufacturing method

Abstract

The invention relates to a pulse laser processing-based novel positive rake diamond abrasive tool manufacturing method, being characterized in that a diamond grinding wheel with orderly-arranged abrasive particles is eroded by pulse laser, so that a vertex angle of the diamond abrasive particles is changed from being greater than 90 degrees to being smaller than 90 degrees, thus a traditional negative rake grinding method of a diamond abrasive tool is changed, and the abrasive particles taking part in the grinding are changed into a positive rake machining mode during grinding. Compared with traditional grinding (namely negative rake grinding), when the positive rake diamond grinding wheel is used for grinding, three processes of scratching, plowing and cutting are not needed, cutting is directly performed, and the traditional grinding machining mode is changed. When the diamond grinding wheel performs positive rake grinding on a hard and brittle material, normal grinding force is less than tangential grinding force, and the normal grinding force and the tangential grinding force during positive rake grinding are both less than those during negative rake grinding, so that surface / subsurface damages, such as microcracks, residual stress, phase change, dislocation and ripple, of the hard and brittle material subjected to grinding are effectively reduced, and the surface completeness of the material can be greatly improved.

Description

technical field [0001] The invention relates to a positive rake diamond abrasive tool with orderly arrangement of abrasive grains and a manufacturing method thereof. The novel grinding tool of the invention can be widely used in grinding of hard and brittle materials. Background technique [0002] At present, the processing of hard and brittle materials such as engineering ceramics, cemented carbide, and chilled cast iron is mainly realized by grinding with superabrasive abrasives (diamond, cubic boron nitride grinding wheel, etc.). However, the high brittleness and high hardness of hard and brittle materials bring great difficulties to the grinding process, which easily leads to the integrity of the grinding surface (mainly manifested as microcracks, residual stress, phase transformation, dislocation, corrugation, etc.) Subsurface damage) is bad, which seriously affects the practical use of hard and brittle materials. [0003] Since the abrasive grains of superhard materi...

AI Technical Summary

Problems solved by technology

However, this method still does not solve the problem that the normal grinding force is greater than the tangential grinding force

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